CY8C3665PVI-008 Cypress Semiconductor Corp, CY8C3665PVI-008 Datasheet - Page 8

• Manufacturer Part Number: CY8C3665PVI-008
• Description: CY8C3665PVI-008
• Manufacturer: Cypress Semiconductor Corp
• Series: PSOC™ 3 CY8C36xxr

Specifications of CY8C3665PVI-008

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 67MHz
• Connectivity: EBI/EMI, I²C, LIN, SPI, UART/USART
• Peripherals: CapSense, DMA, POR, PWM, WDT
• Number Of I /o: 25
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 5.5 V
• Data Converters: A/D 2x12b, D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Technology: CMOS
• Processing Unit: Microcontroller
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Supply Voltage (max): 5.5V
• Package Type: SSOP
• Screening Level: Industrial
• Pin Count: 48
• Mounting: Surface Mount
• Rad Hardened: No
• Processor Series: CY8C36
• Core: 8051
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SPI, UART, USB
• Maximum Clock Frequency: 67 MHz
• Number Of Programmable I/os: 28 to 72
• Number Of Timers: 4
• Operating Supply Voltage: 0.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Controller Family/series: (8051) PSOC 3
• No. Of I/o's: 25
• Eeprom Memory Size: 1KB
• Ram Memory Size: 4KB
• Cpu Speed: 67MHz
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Figure 2-5
analog performance on a two-layer board.
For information on circuit board layout issues for mixed signals, refer to the application note
Layout Considerations for PSoC® 3 and PSoC 5.
Notes
Document Number: 001-53413 Rev. *K
11. Pins are Do Not Use (DNU) on devices without USB. The pin must be left floating.
12. This feature on select devices only. See
13. The center pad on the QFN package should be connected to digital ground (Vssd) for best mechanical, thermal, and electrical performance. If not connected to ground,
The two pins labeled Vddd must be connected together.
The two pins labeled Vccd must be connected together, with capacitance added, as shown in
page 28. The trace between the two Vccd pins should be as short as possible.
The two pins labeled Vssd must be connected together.
it should be electrically floated and not connected to any other signal.
and
Figure 2-6
(configurable XRES, GPIO) P1[2]
(TCK, SWDCK, GPIO) P1[1]
(TMS, SWDIO, GPIO) P1[0]
(TDO, SWV, GPIO) P1[3]
(I2C0: SDA, SIO) P12[5]
(I2C0: SCL, SIO) P12[4]
(nTRST, GPIO) P1[5]
on page 10 show an example schematic and an example PCB layout, for the 100-pin TQFP part, for optimal
(TDI, GPIO) P1[4]
(GPIO) P2[5]
(GPIO) P2[6]
(GPIO) P2[7]
(GPIO) P6[4]
(GPIO) P6[5]
(GPIO) P6[6]
(GPIO) P6[7]
(GPIO) P5[0]
(GPIO) P5[1]
(GPIO) P5[2]
(GPIO) P5[3]
Vboost
XRES
Ordering Information
Vssb
Vssd
Vbat
Ind
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
1
2
3
4
5
6
7
8
9
Lines show Vddio
to I/O supply
association
Figure 2-4. 100-pin TQFP Part Pinout
on page 112 for details.
TQFP
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
PSoC
AN57821 - Mixed Signal Circuit Board
Vddio0
P0[3] (GPIO, OpAmp0-/Extref0)
P0[2] (GPIO, OpAmp0+)
P0[1] (GPIO, OpAmp0out)
P0[0] (GPIO, OpAmp2out)
P4[1] (GPIO)
P4[0] (GPIO)
P12[3] (SIO)
P12[2] (SIO)
Vssd
Vdda
Vssa
Vcca
NC
NC
NC
NC
NC
NC
P15[3] (GPIO, kHz XTAL: Xi)
P15[2] (GPIO, kHz XTAL: Xo)
P12[1] (SIO, I2C1: SDA)
P12[0] (SIO, I2C1: SCL)
P3[7] (GPIO, OpAmp3out)
P3[6] (GPIO, OpAmp1out)
Figure 2-5
®
3: CY8C36 Family
and
Power System
[12]
[12]
Data Sheet
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