AD9779A-EBZ Analog Devices Inc, AD9779A-EBZ Datasheet - Page 7

• Manufacturer Part Number: AD9779A-EBZ
• Description: Dual 16B, 1.0 GSPS TxDAC
• Manufacturer: Analog Devices Inc
• Series: TxDAC®r

Specifications of AD9779A-EBZ

• Design Resources: Interfacing ADL5370 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0016) Interfacing ADL5371 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0017) Interfacing ADL5372 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0018) Interfacing ADL5373 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0019) Interfacing ADL5374 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0020) Interfacing ADL5375 to AD9779A Dual-Channel, 1 GSPS High Speed DAC (CN0021)
• Number Of Dac's: 2
• Number Of Bits: 16
• Outputs And Type: 2, Differential
• Sampling Rate (per Second): 1G
• Data Interface: Serial
• Dac Type: Current
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9779A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Settling Time: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
AVDD33, DVDD33
DVDD18, CVDD18
AGND
DGND
CGND
I120, VREF, IPTAT
OUT1_P, OUT1_N,
OUT2_P, OUT2_N,
AUX1_P, AUX1_N,
AUX2_P, AUX2_N
P1D<15> to P1D<0>,
P2D<15> to P2D<0>
DATACLK, TXENABLE
REFCLK+, REFCLK−
RESET, IRQ, PLL_LOCK,
SYNC_O+, SYNC_O−,
SYNC_I+, SYNC_I−,
CSB, SCLK, SDIO, SDO
Junction Temperature
Storage Temperature
Range
With Respect To
AGND, DGND,
CGND
AGND, DGND,
CGND
DGND, CGND
AGND, CGND
AGND, DGND
AGND
AGND
DGND
DGND
CGND
DGND
Rating
−0.3 V to +3.6 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to
AVDD33 + 0.3 V
−1.0 V to
AVDD33 + 0.3 V
−0.3 V to
DVDD33 + 0.3 V
−0.3 V to
DVDD33 + 0.3 V
−0.3 V to
CVDD18 + 0.3 V
−0.3 V to
DVDD33 + 0.3 V
+125°C
−65°C to +150°C
Rev. A | Page 7 of 60
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
For optimal thermal performance, the exposed paddle (EPAD)
should be soldered to the ground plane for the 100-lead,
thermally enhanced TQFP_EP package.
Typical θ
Airflow increases heat dissipation effectively reducing θ
Table 6. Thermal Resistance
Package Type
100-Lead TQFP_EP
ESD CAUTION
EPAD Soldered
EPAD Not Soldered
JA
and θ
JC
are specified for a 4-layer board in still air.
AD9776A/AD9778A/AD9779A
θ
19.1
27.4
JA
θ
12.4
JB
θ
7.1
JC
JA
.
Unit
°C/W
°C/W