AD9254-150EBZ Analog Devices Inc, AD9254-150EBZ Datasheet - Page 7

• Manufacturer Part Number: AD9254-150EBZ
• Description: 1.8V 14Bit 150 MSPS ADC EB
• Manufacturer: Analog Devices Inc

Specifications of AD9254-150EBZ

• Number Of Adc's: 1
• Number Of Bits: 14
• Sampling Rate (per Second): 150M
• Data Interface: Serial
• Inputs Per Adc: 1 Differential
• Input Range: 2 Vpp
• Power (typ) @ Conditions: 506mW @ 150MSPS
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD9254
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
ELECTRICAL
ENVIRONMENTAL
AVDD to AGND
DRVDD to DGND
AGND to DGND
AVDD to DRVDD
D0 through D13 to DGND
DCO to DGND
OR to DGND
CLK+ to AGND
CLK− to AGND
VIN+ to AGND
VIN− to AGND
VREF to AGND
SENSE to AGND
REFT to AGND
REFB to AGND
SDIO/DCS to DGND
PDWN to AGND
CSB to AGND
SCLK/DFS to AGND
OEB to AGND
Storage Temperature Range
Operating Temperature Range
Lead Temperature
(Soldering 10 Sec)
Junction Temperature
Rating
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−3.9 V to +2.0 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
–65°C to +125°C
–40°C to +85°C
300°C
150°C
Rev. 0 | Page 7 of 40
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP_VQ package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 6. Thermal Resistance
Package Type
48-lead LFCSP_VQ (CP-48-3)
Typical θ
Airflow increases heat dissipation, effectively reducing θ
addition, metal in direct contact with the package leads from
metal traces and through holes, ground, and power planes,
reduces the θ
ESD CAUTION
JA
and θ
JA
.
JC
are specified for a 4-layer board in still air.
θ
26.4
JA
θ
2.4
JC
AD9254
Unit
°C/W
JA
. In