EMIF10-COM01F2 STMicroelectronics, EMIF10-COM01F2 Datasheet - Page 5

• Manufacturer Part Number: EMIF10-COM01F2
• Manufacturer: STMicroelectronics
• Type: EMI Filterr

Specifications of EMIF10-COM01F2

• Mounting Style: Surface Mount
• Termination: Flat Style
• Operating Temp Range: -40C to 85C
• Product Height (mm): 0.65mm
• Lead Free Status / RoHS Status: Compliant

EMIF10-COM01F2
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Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 11. Flip Chip package dimensions
Figure 12. Footprint recommendations
340 µm min for 300 µm copper pad diameter
Solder mask opening recommendation:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Copper pad Diameter:
2.39 mm ± 30 µm
500 µm ± 50
315 µm ± 50
Figure 13. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
650 µm ± 65
Package information
x
y
w
x
E
w
z
®
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