EMIF10-COM01F2 STMicroelectronics, EMIF10-COM01F2 Datasheet

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EMIF10-COM01F2

Manufacturer Part Number
EMIF10-COM01F2
Description
Manufacturer
STMicroelectronics
Type
EMI Filterr
Datasheet

Specifications of EMIF10-COM01F2

Mounting Style
Surface Mount
Termination
Flat Style
Operating Temp Range
-40C to 85C
Product Height (mm)
0.65mm
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EMIF10-COM01F2
Manufacturer:
IDT
Quantity:
4 122
Part Number:
EMIF10-COM01F2
Manufacturer:
ST
0
Features
Complies with the following standard:
Applications
EMI filtering and ESD protection for:
Description
The EMIF10-COM01F2 is a highly integrated
device designed to suppress EMI / RFI noise in all
systems subjected to electromagnetic
interferences. The EMIF10 Flip-Chip packaging
means the package size is equal to the die size.
Additionally, this filter includes an ESD protection
circuitry which prevents damage to the application
when subjected to ESD surges up to 15 kV.
April 2008
EMI symmetrical (I/O) low-pass filter
Lead free package
Very low PCB space consuming: < 6 mm
Very thin package: 0.65 mm
High efficiency in ESD suppression on both
input & output pins
High reliability offered by monolithic integration
IEC 61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
Computers and printers
Communication systems
Mobile phones
10-line IPAD™, EMI filter including ESD protection
2
Rev 5
Figure 1.
Figure 2.
TM: IPAD is a trademark of STMicroelectronics.
Input
EMIF10-COM01F2
GND
Pin configuration (bump side)
Basic cell configuration
010
I10
05
5
I5
(25 bumps)
GND
Low-pass Filter
09
04
4
I4
I9
Flip Chip
R
C
I/O
line
= 200
= 45 pF
GND
08
03
3
I8
I3
Ω
GND
07
02
2
I2
I7
GND
1
06
I6
01
I1
A
B
C
D
E
Output
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EMIF10-COM01F2 Summary of contents

Page 1

... Communication systems ■ Mobile phones Description The EMIF10-COM01F2 is a highly integrated device designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges ...

Page 2

... Figure 4. 0.00 0. -10.00 -10.00 -20.00 -20.00 -30.00 -30.00 -40.00 -40.00 -50.00 -50.00 -60.00 -60.00 -70.00 -70.00 -80.00 -80.00 -90.00 -90.00 -100.00 -100.00 100.0M 100.0M 100.0M 1.0G 1.0G 1.0G EMIF10-COM01F2 Value 15 8 125 - 150 slope : Min. Typ. Max 500 1 180 200 220 ...

Page 3

... EMIF10-COM01F2 Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input (V ) and on one output (V in Figure 7. Rise time measurement Square signal Generator Vc = 2.8V Figure 8. Capacitance versus reverse applied voltage Figure 6. ) out V(in1) V(out1) EMIF10-COM01F2 In Out Vout Vin 100k C(pF VR(V) Characteristics ...

Page 4

... EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 10(pF letters = application 2 digits = version Package F = Flip Chip Lead-free, pitch = 500 µm, bump = 315 µm 4/7 200R out MODEL = demif10 sub EMIF yy EMIF10-COM01F2 Demif10 model IBV = 1m CJO = 25p M = 0.3333 0 100n - xxx zz Fx ...

Page 5

... EMIF10-COM01F2 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...

Page 6

... Replaced Figures 3 and 13. Added ECOPACK 3 statement. Reformatted to current standard. Pin identification in 4 Figure 1 updated. Updated ECOPACK statement. Updated 5 Figure 11 and standards. EMIF10-COM01F2 Ø 1.5 ± 0.1 2.6 4 ± 0.1 Base qty Delivery mode 5000 Tape and reel Description of changes Figure Figure 14. ...

Page 7

... EMIF10-COM01F2 Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...

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