EMIF10-1K010F2_08 STMICROELECTRONICS [STMicroelectronics], EMIF10-1K010F2_08 Datasheet

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EMIF10-1K010F2_08

Manufacturer Part Number
EMIF10-1K010F2_08
Description
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Features
Complies with the following standards:
Applications
Where EMI filtering in ESD sensitive equipment is
required:
Description
The EMIF10-1K010F2 is a highly integrated
device designed to suppress EMI / RFI noise in all
systems subjected to electromagnetic
interferences. The EMIF10 Flip-Chip packaging
means the package size is equal to the die size.
Additionally, this filter includes an ESD protection
circuitry which prevents damage to the application
when subjected to ESD surges up to 15 kV.
April 2008
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Lead free package
Very low PCB space consuming:
2.42 mm x 2.42 mm
Very thin package: 0.650 mm
High efficiency in ESD suppression on both
input and output pins (IEC 61000-4-2 level 4)
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration & wafer level packaging
IEC 61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883F - Method 3015.7 Class 3
Mobile Phones
Computers and printers
Communication systems
MCU Boards
10-line IPAD™, EMI filter including ESD protection
Rev 4
Figure 1.
Figure 2.
TM: IPAD is a trademark of STMicroelectronics.
Input
010
I10
09
Pin configuration (bump side)
I7
Basic cell configuration
5
I9
EMIF10-1K010F2
Low pass filter
GND
GND
07
08
(24 bumps)
4
I8
Flip Chip
C
R
line
I/O
GND
GND
= 100 pF
05
06
I6
3
= 1 k
Ω
03
04
I4
2
I3
I5
02
01
I2
I1
1
A
B
C
D
E
Output
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EMIF10-1K010F2_08 Summary of contents

Page 1

... Communication systems ■ MCU Boards Description The EMIF10-1K010F2 is a highly integrated device designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges ...

Page 2

... I MHz V line 2 °C) amb Parameter and test conditions = 25 °C) amb Parameter RM Test conditions = 2.5 µ OSC line EMIF10-1K010F2 Value 125 - 150 Min. ...

Page 3

... EMIF10-1K010F2 Figure 3. S21(db) attenuation measurement 0. 10.00 - 20.00 - 30.00 - 40.00 - 50.00 1.0M 3.0M 10.0M 30.0M f/Hz Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input (V ) and on one output (V in Figure 7. Capacitance versus reverse applied voltage Figure 4. 100.0M 300.0M 1.0G 3.0G Figure 6. ) out INPUT OUTPUT C (pF) 120 Input / GND 100 ( 0.0 1.0 2.0 3.0 Characteristics ...

Page 4

... Application information 2 Application information Figure 8. Aplac model Port15 50 - Rgnd Lgnd Ii MODEL = demif10 Figure 9. Aplac parametersl 4/8 50pH 50m 50pH Ii Oi cap_line cap_line Rgnd Lgnd Rgnd Lgnd Rseries Oi Ii GNDi MODEL = demif10 Oi sub Cz 57pF Rseries 960 cap_line 0.8pF Ls 0.6nH Rbump 50m Lbump ...

Page 5

... EMIF10-1K010F2 3 Ordering information scheme Figure 10. Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 100 (pF letters = application 2 digits = version Package F = Flip Chip lead-free pitch = 500 µm, bump = 315 µm 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK packages ...

Page 6

... Dot, ST logo xx = marking z = manufacturing location yww = datecode Dot identifying Pin A1 location 4 ± 0.1 0.73 ± 0.05 User direction of unreeling All dimensions in mm Marking Package Weight FD Flip Chip 7.9 mg EMIF10-1K010F2 (y = year ww = week Ø 1.5 ± 0.1 2.60 4 ± 0.1 Base qty Delivery mode 5000 Tape and reel ...

Page 7

... EMIF10-1K010F2 6 Revision history Table 4. Document revision history Date 12-Oct-2004 28-Aug-2006 18-Sep-2006 17-Apr-2008 Revision 1 First issue. 2 Die layout upgrade. 3 Added pocket dimensions to Figure 11. Updated ECOPACK statement. Updated 4 Figure 12. and Figure 14. Revision history Description of changes Figure 10, Figure Reformatted to current standards. 11, 7/8 ...

Page 8

... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF10-1K010F2 ...

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