EMIF10-1K010F2 STMicroelectronics, EMIF10-1K010F2 Datasheet

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EMIF10-1K010F2

Manufacturer Part Number
EMIF10-1K010F2
Description
Manufacturer
STMicroelectronics
Datasheet

Specifications of EMIF10-1K010F2

Mounting Style
Surface Mount
Termination
Flat Style
Operating Temp Range
-40C to 85C
Product Height (mm)
0.65mm
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EMIF10-1K010F2
Manufacturer:
RIVER
Quantity:
2 528
Part Number:
EMIF10-1K010F2
Manufacturer:
ST
0
Features
Complies with the following standards:
Applications
Where EMI filtering in ESD sensitive equipment is
required:
Description
The EMIF10-1K010F2 is a highly integrated
device designed to suppress EMI / RFI noise in all
systems subjected to electromagnetic
interferences. The EMIF10 Flip-Chip packaging
means the package size is equal to the die size.
Additionally, this filter includes an ESD protection
circuitry which prevents damage to the application
when subjected to ESD surges up to 15 kV.
April 2008
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Lead free package
Very low PCB space consuming:
2.42 mm x 2.42 mm
Very thin package: 0.650 mm
High efficiency in ESD suppression on both
input and output pins (IEC 61000-4-2 level 4)
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration & wafer level packaging
IEC 61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883F - Method 3015.7 Class 3
Mobile Phones
Computers and printers
Communication systems
MCU Boards
10-line IPAD™, EMI filter including ESD protection
Rev 4
Figure 1.
Figure 2.
TM: IPAD is a trademark of STMicroelectronics.
Input
010
I10
09
Pin configuration (bump side)
I7
Basic cell configuration
5
I9
EMIF10-1K010F2
Low pass filter
GND
GND
07
08
(24 bumps)
4
I8
Flip Chip
C
R
line
I/O
GND
GND
= 100 pF
05
06
I6
3
= 1 k
Ω
03
04
I4
2
I3
I5
02
01
I2
I1
1
A
B
C
D
E
Output
www.st.com
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EMIF10-1K010F2 Summary of contents

Page 1

... Communication systems ■ MCU Boards Description The EMIF10-1K010F2 is a highly integrated device designed to suppress EMI / RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges ...

Page 2

... Resistance between Input and Output I/O C Input capacitance per line line Symbol per line I MHz V line 2 °C) amb Parameter and test conditions = 25 °C) amb Parameter RM Test conditions = 2.5 µ OSC line EMIF10-1K010F2 Value 125 - 150 Min. Typ. Max 200 1 900 1000 1100 80 100 120 Unit kV ° ...

Page 3

... EMIF10-1K010F2 Figure 3. S21(db) attenuation measurement 0. 10.00 - 20.00 - 30.00 - 40.00 - 50.00 1.0M 3.0M 10.0M 30.0M f/Hz Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input (V ) and on one output (V in Figure 7. Capacitance versus reverse applied voltage Figure 4. 100.0M 300.0M 1.0G 3.0G Figure 6. ...

Page 4

... Ls 0.6nH Rbump 50m Lbump 50pH Rs 0.15 Csubump 15pF Rsubump 0.15 Rsub 0.1 lhole 1.2nH opt Rhole 0.15 cap_hole 0.15pF Rgnd 0.25 Ignd 0.4nH EMIF10-1K010F2 50m Port16 50 - Rgnd Lgnd Csubump Rsubump + cap_hole Rsub sub Csubump Rsubump + Model demif10 IBV = 1m CJO = 0.3333 ...

Page 5

... EMIF10-1K010F2 3 Ordering information scheme Figure 10. Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 100 (pF letters = application 2 digits = version Package F = Flip Chip lead-free pitch = 500 µm, bump = 315 µm 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK packages ...

Page 6

... Dot identifying Pin A1 location 4 ± 0.1 0.73 ± 0.05 User direction of unreeling All dimensions in mm Marking Package Weight FD Flip Chip 7.9 mg EMIF10-1K010F2 (y = year ww = week Ø 1.5 ± 0.1 2.60 4 ± 0.1 Base qty Delivery mode 5000 Tape and reel ...

Page 7

... EMIF10-1K010F2 6 Revision history Table 4. Document revision history Date 12-Oct-2004 28-Aug-2006 18-Sep-2006 17-Apr-2008 Revision 1 First issue. 2 Die layout upgrade. 3 Added pocket dimensions to Figure 11. Updated ECOPACK statement. Updated 4 Figure 12. and Figure 14. Revision history Description of changes Figure 10, Figure Reformatted to current standards. 11, 7/8 ...

Page 8

... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF10-1K010F2 ...

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