EMIF10-LCD02F3_08 STMICROELECTRONICS [STMicroelectronics], EMIF10-LCD02F3_08 Datasheet
EMIF10-LCD02F3_08
Related parts for EMIF10-LCD02F3_08
EMIF10-LCD02F3_08 Summary of contents
Page 1
... Communication systems ■ MCU boards Description The EMIF10-LCD02F3 is a 10-line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF10 Flip Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 15kV ...
Page 2
... Tolerance ± 20 Vline = line 2/8 amb Parameter and test conditions = 25 °C) amb Parameters RM Test conditions = mV MHz OSC EMIF10-LCD02F3 = 25 °C) Value 125 -40 to +85 -55 to 150 Min ...
Page 3
... EMIF10-LCD02F3 Figure 3. S21(dB) all lines attenuation measurement and Aplac simulation Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input and on one output Figure 7. Line capacitance versus applied voltage Figure 4. -10.00 -10.00 -10.00 -20.00 -20.00 -20.00 -30.00 -30.00 -30.00 -40.00 -40.00 -40.00 -50.00 -50.00 -50.00 -60.00 -60.00 -60.00 -70.00 -70.00 -70.00 -80.00 -80.00 -80.00 -90.00 -90.00 -90.00 -100.00 -100.00 -100.00 Figure 6. Input 10V/d Output 10V/d 100ns/d ...
Page 4
... Lbump Rbump Rline I1 MODEL = D1 bulk bulk MODEL = D3 Rbump Rbump Cbump Cbump Cbump Lbump Lbump Rgnd Rgnd Lgnd Lgnd Diode D1 BV=7 IBV=1m CJO=C_d1 M=0.28 RS=0.1 VJ=0.6 TT=100n EMIF10-LCD02F3 Rbump Lbump O1 MODEL = D2 Rbump Rbump Cbump Lbump Lbump Rgnd Rgnd Lgnd Lgnd Diode D2 Diode D3 BV=7 BV=7 IBV=1m IBV=1m CJO=C_d2 CJO=C_d3 M=0.28 M=0.28 RS=0.1 RS=0.01 VJ=0.6 VJ=0 ...
Page 5
... EMIF10-LCD02F3 3 Ordering information scheme Figure 10. Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 10 (pF letters = application 2 digits = version Package F = Flip Chip 3 = Lead-free, pitch = 400 µm, bump = 255 µm 4 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK packages ...
Page 6
... EMIF10-LCD02F3 6/8 Figure 13. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode Dot identifying Pin A1 location 4 ± 0.1 User direction of unreeling Marking Package Weight GY Flip Chip 5.0 mg EMIF10-LCD02F3 (y = year ww = week Ø 1.5 ± 0.1 2.11 4 ± 0.1 Base qty Delivery mode 5000 Tape and reel 7” ...
Page 7
... EMIF10-LCD02F3 6 Revision history Table 4. Document revision history Date 11-Jul-2005 28-Apr-2008 Revision 1 First issue. Updated ECOPACK statement. Updated 2 Figure 12 and Figure 14. Revision history Changes Figure 10, Figure Reformatted to current standards. 11, 7/8 ...
Page 8
... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF10-LCD02F3 ...