EMIF10-LCD01F3 STMICROELECTRONICS [STMicroelectronics], EMIF10-LCD01F3 Datasheet

no-image

EMIF10-LCD01F3

Manufacturer Part Number
EMIF10-LCD01F3
Description
10 LINES EMI FILTER AND ESD PROTECTION
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
MAIN PRODUCT CHARACTERISTICS:
Where EMI filtering in ESD sensitive equipment is
required :
DESCRIPTION
The EMIF10-LCD01F1 is a 10 lines highly
integrated devices designed to suppress EMI/RFI
noise in all systems subjected to electromagnetic
interferences. The EMIF10 flip chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry,
which prevents the device from destruction when
subjected to ESD surges up 15kV.
BENEFITS
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4 input pins 15kV (air discharge)
Level 1 output pins 2kV
MIL STD 883E - Method 3015-6 Class 3
BASIC CELL CONFIGURATION
TM : IPAD is a trademark of STMicroelectronics.
November 2003 - Ed: 2A
LCD for Mobile phones
Computers and printers
Communication systems
MCU Boards
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Very low PCB space consuming:
2.64mm x 2.64mm
Very thin package: 0.65 mm
High efficiency in ESD suppression on input
pins (IEC6100-4-2 level 4)
High reliability offered by monolithic integration
High reducing of parasitic elements through in-
tegration & wafer level packaging.
®
IPAD
8 kV
2kV
Input
TM
(contact discharge)
(air discharge)
(contact discharge)
GND
Low-pass Filter
GND
PIN CONFIGURATION (ball side)
GND
AND ESD PROTECTION
Output
GND
O10
I10
O5
5
I5
EMIF10-LCD01F1
10 LINES EMI FILTER
Flip Chip package
GND
O9
O4
I4
I9
4
Ri/o = 100
Cline = 35pF
GND
O8
O3
3
I3
I8
GND
O7
O2
2
I2
I7
GND
O6
O1
I6
1
I1
A
B
C
D
E
1/6

Related parts for EMIF10-LCD01F3

EMIF10-LCD01F3 Summary of contents

Page 1

... LCD for Mobile phones Computers and printers Communication systems MCU Boards DESCRIPTION The EMIF10-LCD01F1 lines highly integrated devices designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 flip chip packaging means the package size is equal to the die size. ...

Page 2

... EMIF10-LCD01F1 ABSOLUTE MAXIMUM RATINGS (T Symbol Parameter and test conditions T Maximum junction temperature j T Operating temperature range op T Storage temperature range stg ELECTRICAL CHARACTERISTICS (T Symbol Parameters V Breakdown voltage BR I Leakage current @ Stand-off voltage RM Clamping voltage Dynamic impedance d I Peak pulse current ...

Page 3

... Fig. 5: Line capacitance versus applied voltage. CLine(pF VLine( 0.0 1.0 2.0 3.0 Fig. 7: Fall time 10-90% measurements with 1.9V signal at 26 MHz frequency (50 generator). Fig. 4: ESD response to IEC61000-4-2 (-15kV air discharge) on one input and one output. Fig. 6: Rise time 10-90% measurements with 1.9V signal at 26 MHz frequency (50 generator). 4.0 5.0 EMIF10-LCD01F1 3/6 ...

Page 4

... Application (3 letters) and Version (2 digits) 4/6 EMIF10-LCD01F1 model - xxx Flip Chip or Ground return CJO = Cemif10low IBV = 1u IKF = 1000 IS = 10f ISR = 100p 0.3333 RS = 0.015 50n 1: Pitch = 500µm Bump = 315µm 2: Leadfree Pitch = 500µm Bump = 315µm 3: Leadfree Pitch = 400µm Bump = 250µm ...

Page 5

... MARKING Dot, ST logo xxx = marking yww = datecode All dimensions in µm 315µm ± 50 2.64mm ± 50µm Copper pad Diameter : 545 400 (y = year ww = week EMIF10-LCD01F1 650µm ± 65 250µm ± 5/6 ...

Page 6

... All dimensions in mm OTHER INFORMATION Ordering code Marking EMIF10-LCD01F1 FLT Note: More information are available in the application notes: - AN1235: ''Flip-Chip: Package description and recommandations for use'' - AN1751: "EMI Filters: Recommendations and measurements" Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use ...

Related keywords