EMIF10-COM01F2 STMicroelectronics, EMIF10-COM01F2 Datasheet - Page 4

• Manufacturer Part Number: EMIF10-COM01F2
• Manufacturer: STMicroelectronics
• Type: EMI Filterr

Specifications of EMIF10-COM01F2

• Mounting Style: Surface Mount
• Termination: Flat Style
• Operating Temp Range: -40C to 85C
• Product Height (mm): 0.65mm
• Lead Free Status / RoHS Status: Compliant

Application information
2
2.1
3
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Application information
Figure 9.
PCB grounding recommendations
In order to ensure a good efficiency in terms of ESD protection and filtering behavior, we
recommend to implement microvias (100 µm dia.) between the GND bumps and the GND
layer. GND bumps can be connected together in PCB layer 1, and in addition, if possible,
use through hole vias (200 µm dia.) in both sides of filter to improve contact to GND (layer).
This layout will minimize the distance to the ground and thus parasitic inductances. In
addition, we recommend to have GND plane wherever possible.
Ordering information scheme
Figure 10. Ordering information scheme
MODEL = demif10
in
Aplac model
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
Package
F = Flip Chip
x = 2: Lead-free, pitch = 500 µm, bump = 315 µm
200R
sub
MODEL = demif10
EMIF
out
yy
-
xxx zz
Demif10 model
BV = 7
IBV = 1m
CJO = 25p
M = 0.3333
RS = 1
VJ = 0.6
TT = 100n
EMIF10-COM01F2
Fx