C500RM201 Omron, C500RM201 Datasheet - Page 11

• Manufacturer Part Number: C500RM201
• Description: WRITE MASTER
• Manufacturer: Omron

Specifications of C500RM201

• Leaded Process Compatible: No
• Peak Reflow Compatible (260 C): No
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

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Application Precautions
Operating Environment Precautions
Application Precautions
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WARNING
Caution
Caution
Caution
Do not operate the control system in the following locations:
Take appropriate and sufficient countermeasures when installing systems in the
following locations:
The operating environment of the Wired Remote I/O System can have a large
effect on the longevity and reliability of the system. Improper operating environ-
ments can lead to malfunction, failure, and other unforeseeable problems with
the System. Be sure that the operating environment is within the specified condi-
tions at installation and remains within the specified conditions during the life of
the System.
Observe the following precautions when using the Wired Remote I/O System.
Always heed these precautions. Failure to abide by the following precautions
could lead to serious or possibly fatal injury.
Emergency stop circuits, interlock circuits, limit circuits, and similar safety
measures must be provided in external control circuits.
The PC will turn OFF all outputs when its self-diagnosis function detects any
error or when a severe failure alarm (FALS) instruction is executed. As a coun-
termeasure for such errors, external safety measures must be provided to en-
sure safety in the system.
The PC outputs may remain ON or OFF due to deposition or burning of the
output relays or destruction of the output transistors. As a countermeasure for
such problems, external safety measures must be provided to ensure safety in
the system.
Locations subject to direct sunlight.
Locations subject to temperatures or humidity outside the range specified in
the specifications.
Locations subject to condensation as the result of severe changes in tempera-
ture.
Locations subject to corrosive or flammable gases.
Locations subject to dust (especially iron dust) or salts.
Locations subject to exposure to water, oil, or chemicals.
Locations subject to shock or vibration.
Locations subject to static electricity or other forms of noise.
Locations subject to strong electromagnetic fields.
Locations subject to possible exposure to radioactivity.
Locations close to power supplies.
Always ground the system to 100
necting to a ground of 100
Always turn OFF the power supply to the PC before attempting any of the fol-
lowing. Not turning OFF the power supply may result in malfunction or electric
shock.
Mounting or dismounting I/O Units, CPU Units, Memory Units, or any other
Units.
or less may result in electric shock.
or less when installing the Units. Not con-
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