DSPIC30F5011-20E/PT Microchip Technology, DSPIC30F5011-20E/PT Datasheet - Page 205

IC,DSP,16-BIT,CMOS,TQFP,64PIN,PLASTIC

DSPIC30F5011-20E/PT

Manufacturer Part Number
DSPIC30F5011-20E/PT
Description
IC,DSP,16-BIT,CMOS,TQFP,64PIN,PLASTIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F5011-20E/PT

Rohs Compliant
YES
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
66KB (22K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DSPIC30F5011-20E/PTG
DSPIC30F501120EPT
DSPIC30F501120EPT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F5011-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
© 2011 Microchip Technology Inc.
80-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
Dimension Limits
E1
φ
NOTE 2
Units
L
A2
A1
E1
D1
L1
N
A
E
D
α
e
L
φ
c
b
β
E
A1
A
dsPIC30F5011/5013
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
MILLIMETERS
L1
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
12°
12°
80
Microchip Technology Drawing C04-092B
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
A2
DS70116J-page 205
α

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