DSPIC30F5011-20E/PT Microchip Technology, DSPIC30F5011-20E/PT Datasheet - Page 172

IC,DSP,16-BIT,CMOS,TQFP,64PIN,PLASTIC

DSPIC30F5011-20E/PT

Manufacturer Part Number
DSPIC30F5011-20E/PT
Description
IC,DSP,16-BIT,CMOS,TQFP,64PIN,PLASTIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F5011-20E/PT

Rohs Compliant
YES
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
66KB (22K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TFQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
DSPIC30F5011-20E/PTG
DSPIC30F501120EPT
DSPIC30F501120EPT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F5011-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
dsPIC30F5011/5013
TABLE 23-11: ELECTRICAL CHARACTERISTICS: BOR
TABLE 23-12: DC CHARACTERISTICS: PROGRAM AND EEPROM
DS70116J-page 172
DC CHARACTERISTICS
BO10
BO15
Note 1:
DC CHARACTERISTICS
D120
D121
D122
D123
D124
D130
D131
D132
D133
D134
D135
D137
D138
Note 1:
Param
Param
No.
No.
2:
3:
2:
E
V
T
T
I
E
V
V
V
T
T
I
I
Symbol
DEW
PEW
EB
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
11 values not in usable operating range.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
These parameters are characterized but not tested in manufacturing.
DEW
RETD
EB
PEW
RETD
V
V
D
DRW
P
PR
PEW
Symbol
BOR
BHYS
Data EEPROM Memory
Byte Endurance
V
Erase/Write Cycle Time
Characteristic Retention
I
Program FLASH Memory
Cell Endurance
V
V
V
Erase/Write Cycle Time
Characteristic Retention
I
I
DD
DD
DD
DD
DD
DD
DD
BOR Voltage
V
low
During Programming
During Programming
During Programming
DD
for Read/Write
for Read
for Bulk Erase
for Erase/Write
Characteristic
transition high to
Characteristic
(2)
on
(2)
(2)
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
BORV = 11
BORV = 10
BORV = 01
BORV = 00
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
100K
V
V
Min
10K
0.8
4.5
3.0
0.8
40
40
MIN
MIN
Typ
100K
(3)
100
100
1M
10
10
10
2
2
(1)
2.60
4.10
4.58
Min
Max
5.5
2.6
5.5
5.5
5.5
2.6
30
30
30
Typ
-40°C ≤ T
-40°C ≤ T
5
-40°C ≤ T
-40°C ≤ T
Units
(1)
Year
Year
E/W
E/W
mA
mA
mA
ms
ms
V
V
V
V
A
A
Max
2.71
4.40
4.73
≤ +85°C for Industrial
≤ +125°C for Extended
-40° C ≤ T
Using EECON to read/write
V
voltage
RTSP
Provided no other specifications
are violated
Row Erase
-40° C ≤ T
V
voltage
RTSP
Provided no other specifications
are violated
Row Erase
Bulk Erase
A
A
MIN
MIN
≤ +85°C for Industrial
≤ +125°C for Extended
© 2011 Microchip Technology Inc.
Units
= Minimum operating
= Minimum operating
mV
V
V
V
V
A
A
Conditions
≤ +85°C
≤ +85°C
Not in operating
range
Conditions

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