LPC2292FBD144 NXP Semiconductors, LPC2292FBD144 Datasheet - Page 2

16/32BIT ARM7 MCU, 256K FLASH, 144LQFP

LPC2292FBD144

Manufacturer Part Number
LPC2292FBD144
Description
16/32BIT ARM7 MCU, 256K FLASH, 144LQFP
Manufacturer
NXP Semiconductors
Datasheet

Specifications of LPC2292FBD144

No. Of I/o's
112
Ram Memory Size
16KB
Cpu Speed
60MHz
No. Of Timers
2
No. Of Pwm Channels
6
Digital Ic Case
RoHS Compliant
Core Size
32bit
Program Memory Size
256KB
Oscillator Type
External Only
Controller Family/series
LPC22xx
Rohs Compliant
Yes

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NXP Semiconductors
3. Ordering information
LPC2292_2294_7
Product data sheet
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Table 1.
Type number
LPC2292FBD144
LPC2292FBD144/00
LPC2292FBD144/01
LPC2292FET144/00
LPC2292FET144/01
LPC2292FET144/G
16 kB on-chip static RAM and 256 kB on-chip flash program memory. 128-bit wide
interface/accelerator enables high-speed 60 MHz operation.
In-System Programming/In-Application Programming (ISP/IAP) via on-chip bootloader
software. Single flash sector or full chip erase in 400 ms and programming of 256 B in
1 ms.
EmbeddedICE-RT and Embedded Trace interfaces offer real-time debugging with the
on-chip RealMonitor software as well as high-speed real-time tracing of instruction
execution.
Two/four (LPC2292/LPC2294) interconnected CAN interfaces with advanced
acceptance filters. Additional serial interfaces include two UARTs (16C550), Fast
I
Eight channel 10-bit ADC with conversion time as low as 2.44 s.
Two 32-bit timers (with four capture and four compare channels), PWM unit (six
outputs), Real-Time Clock (RTC), and watchdog.
Vectored Interrupt Controller (VIC) with configurable priorities and vector addresses.
Configurable external memory interface with up to four banks, each up to 16 MB and
8/16/32-bit data width.
Up to 112 general purpose I/O pins (5 V tolerant). Up to nine edge/level sensitive
external interrupt pins available.
60 MHz maximum CPU clock available from programmable on-chip PLL with settling
time of 100 s.
The on-chip crystal oscillator should have an operating range of 1 MHz to 25 MHz.
Power saving modes include Idle and Power-down.
Processor wake-up from Power-down mode via external interrupt.
Individual enable/disable of peripheral functions for power optimization.
Dual power supply:
2
N
N
C-bus (400 kbit/s) and two SPIs.
CPU operating voltage range of 1.65 V to 1.95 V (1.8 V
I/O power supply range of 3.0 V to 3.6 V (3.3 V
Ordering information
Rev. 7 — 4 December 2008
16/32-bit ARM microcontrollers with external memory interface
Package
Name
LQFP144
LQFP144
LQFP144
TFBGA144 plastic thin fine-pitch ball grid array package;
TFBGA144 plastic thin fine-pitch ball grid array package;
TFBGA144 plastic thin fine-pitch ball grid array package;
Description
plastic low profile quad flat package;
144 leads; body 20
plastic low profile quad flat package;
144 leads; body 20
plastic low profile quad flat package;
144 leads; body 20
144 balls; body 12
144 balls; body 12
144 balls; body 12
LPC2292/LPC2294
12
12
12
20
20
20
10 %) with 5 V tolerant I/O pads.
0.8 mm
0.8 mm
0.8 mm
1.4 mm
1.4 mm
1.4 mm
0.15 V).
© NXP B.V. 2008. All rights reserved.
Version
SOT486-1
SOT486-1
SOT486-1
SOT569-2
SOT569-2
SOT569-2
2 of 53

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