LAN9218-MT SMSC, LAN9218-MT Datasheet - Page 37

CONTROLLER, ENET, 10/100, 100TQFP

LAN9218-MT

Manufacturer Part Number
LAN9218-MT
Description
CONTROLLER, ENET, 10/100, 100TQFP
Manufacturer
SMSC
Datasheet

Specifications of LAN9218-MT

Data Rate
100Mbps
No. Of Ports
2
Ethernet Type
IEEE 802.3 / 802.3u
Supply Current
40mA
Supply Voltage Range
2.97V To 3.63V
Operating Temperature Range
0°C To +70°C
Digital Ic Case Style
TQFP
Interface Type
HBI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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0
High-Performance Single-Chip 10/100 Ethernet Controller with HP Auto-MDIX
Datasheet
SMSC
3.8.2.2
3.8.2.3
3.8.2.4
EEDIO (OUTPUT)
EEDIO (INPUT)
LAN9218
EECLK
EECS
WRAL (Write All): If erase/write operations are enabled in the EEPROM, this command will cause the
contents of the E2P_DATA register to be written to every EEPROM memory location. The EPC_TO bit
is set if the EEPROM does not respond within 30ms.
Table 3.8, "Required EECLK
each EEPROM operation.
MAC Address Reload
The MAC address can be reloaded from the EEPROM via a host command to the E2P_CMD register.
If a value of 0xA5h is not found in the first address of the EEPROM, the EEPROM is assumed to be
un-programmed and MAC Address Reload operation will fail. The “MAC Address Loaded” bit indicates
a successful load of the MAC address. The EPC_LOAD bit is set after a successful reload of the MAC
address.
EEPROM Command and Data Registers
Refer to
"E2P_DATA – EEPROM Data Register," on page 95
Supported EEPROM operations are described in these sections.
EEPROM Timing
Refer to
OPERATION
ERASE
WRITE
EWDS
EWEN
READ
WRAL
ERAL
Section 5.3.23, "E2P_CMD – EEPROM Command Register," on page 93
Section 6.9, "EEPROM Timing," on page 126
1
0
0
Table 3.8 Required EECLK Cycles
Figure 3.9 EEPROM WRAL Cycle
0
Cycles", shown below, shows the number of EECLK cycles required for
1
DATASHEET
37
REQUIRED EECLK CYCLES
D7
for detailed EEPROM timing specifications.
for a detailed description of these registers.
D0
10
10
10
10
18
18
18
t
CSL
Revision 1.93 (11-27-07)
and
Section 5.3.24,

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