HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 537

MCU 3V 0K I-TEMP 100-TQFP

HD6413008VXI25

Manufacturer Part Number
HD6413008VXI25
Description
MCU 3V 0K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413008VXI25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
19.6.3
Bus timing is shown as follows:
• Basic bus cycle: two-state access
• Basic bus cycle: three-state access
• Basic bus cycle: three-state access with one wait state
• Bus-release mode timing
Figure 19.7 shows the timing of the external two-state access cycle.
Figure 19.8 shows the timing of the external three-state access cycle.
Figure 19.9 shows the timing of the external three-state access cycle with one wait state
inserted.
Figure 19.10 shows the bus-release mode timing.
Bus Timing
Rev.4.00 Aug. 20, 2007 Page 491 of 638
19. Electrical Characteristics
REJ09B0395-0400

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