HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 179

MCU 3V 0K I-TEMP 100-TQFP

HD6413008VXI25

Manufacturer Part Number
HD6413008VXI25
Description
MCU 3V 0K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413008VXI25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Pin Wait Insertion: Setting the WAITE bit in BCR to 1 enables wait insertion by means of the
WAIT pin. When external space is accessed in this state, a program wait is first inserted. If the
WAIT pin is low at the falling edge of φ in the last T
the WAIT pin is held low, T
This is useful when inserting four or more T
different external devices.
The WAITE bit setting applies to all areas.
Figure 6.17 shows an example of the timing for insertion of one program wait state in 3-state
space.
Read access
Write access
Figure 6.17 Example of Wait State Insertion Timing
Address bus
Note:
HWR, LWR
W
Data bus
Data bus
states are inserted until it goes high.
WAIT
φ
indicates the timing of WAIT pin sampling.
RD
AS
T
W
1
states, or when changing the number of T
Inserted
by program wait Inserted by WAIT pin
T
2
2
or T
Rev.4.00 Aug. 20, 2007 Page 133 of 638
T
W
w
state, another T
Write data
T
w
T
w
Read data
W
state is inserted. If
T
REJ09B0395-0400
3
6. Bus Controller
W
states for

Related parts for HD6413008VXI25