HD6413008VXI25 Renesas Electronics America, HD6413008VXI25 Datasheet - Page 513

MCU 3V 0K I-TEMP 100-TQFP

HD6413008VXI25

Manufacturer Part Number
HD6413008VXI25
Description
MCU 3V 0K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD6413008VXI25

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
18.4.4
Figure 18.1 shows an example in which software standby mode is entered at the fall of NMI and
exited at the rise of NMI.
With the NMI edge select bit (NMIEG) cleared to 0 in SYSCR (selecting the falling edge), an
NMI interrupt occurs. Next the NMIEG bit is set to 1 (selecting the rising edge) and the SSBY bit
is set to 1; then the SLEEP instruction is executed to enter software standby mode.
Software standby mode is exited at the next rising edge of the NMI signal.
18.4.5
The I/O ports retain their existing states in software standby mode. If a port is in the high output
state, its output current is not reduced.
Clock
oscillator
φ
NMI
NMIEG
SSBY
Sample Application of Software Standby Mode
Note
Figure 18.1 NMI Timing for Software Standby Mode (Example)
NMI interrupt
handler
NMIEG = 1
SSBY = 1
SLEEP
instruction
Software standby
mode (power-
down state)
Rev.4.00 Aug. 20, 2007 Page 467 of 638
Oscillator
settling time
(t
osc2
)
18. Power-Down State
NMI exception
handling
REJ09B0395-0400

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