MAXQ3108-FFN+ Maxim Integrated Products, MAXQ3108-FFN+ Datasheet - Page 5

IC MCU DUAL-CORE 16BIT 28-TSSOP

MAXQ3108-FFN+

Manufacturer Part Number
MAXQ3108-FFN+
Description
IC MCU DUAL-CORE 16BIT 28-TSSOP
Manufacturer
Maxim Integrated Products
Series
MAXQ™r
Datasheet

Specifications of MAXQ3108-FFN+

Core Processor
RISC
Core Size
16-Bit
Speed
10MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
21
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Ram Size
11K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
28-TSSOP
Processor Series
MAXQ
Core
RISC
Data Bus Width
16 bit
Data Ram Size
2 KB
Interface Type
I2C, JTAG, SPI
Maximum Clock Frequency
10 MHz
Number Of Programmable I/os
22
Number Of Timers
2
Operating Supply Voltage
3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
RECOMMENDED DC OPERATING CONDITIONS (continued)
(V
Note 1: Results based on simulation data. Characterization data will be available at a later date. All voltages are referenced to
Note 2: Typical values are not guaranteed. These values are measured at room temperature, V
Note 3: This current is from V
Note 4: Measured on the V
Note 5: If the RTC is on for parameters ISTOP_2, ISTOP_3, and ISTOP_4, a current equal to I
Note 6: The maximum total current, I
Note 7: The timing listed above is clocked by 63 cycles of the internal 1MHz ±5% clock. There will be ROM code overhead, which is
Input/Output Pin Capacitance
Input Low Current All Pins
Input-Leakage Current
Input Pullup Resistor (All Inputs)
CLOCK SOURCE
FLL Output Frequency
FLL Output Accuracy
FLASH MEMORY
System Clock During Flash
Programming/Erase
Flash Erase Time
Flash Programming Time Per
Word
Write/Erase Cycles
Data Retention
SUPPLY VOLTAGE MONITOR
Set Point
Increment Resolution
Default Set Point
Current Consumption
Start Time
Setup Time (Change Set Point)
Setup Time (Stop Mode Exit)
REAL-TIME CLOCK
RTC Input Frequency
RTC Operating Current
DD
= V
RST
ground. Specifications to T
is from V
any current. Timer enabled, RTC enabled, part executing JUMP $ from flash.
mum specified voltage drop.
a function of system clock. For data sheet purposes, a better way is to specify the limits that include ROM code execution
with specified system clock speed.
PARAMETER
to 3.6V, T
DD
.
_______________________________________________________________________________________
A
= -40°C to +85°C.) (Notes 1, 2)
DD
Low-Power, Dual-Core Microcontroller
BAT
pin and the device not in reset. All inputs are connected to V
only if (V
A
SYMBOL
OH(MAX)
t
t
= -40°C are guaranteed by design and are not production tested.
SVM_SU1
SVM_SU2
t
f
SVMST
SV
I
32KIN
I
R
C
f
SVM
RTC
I
FLL
f
I
IL
PU
FLL
IO
L
TR
DD
< V
and I
Guaranteed by design
V
Internal pullup disabled
CX1 = 32.768kHz
CX1 = 32.768kHz
Mass erase
Page erase
(Note 7)
T
Changing from one set point to another set
point
Exit from stop mode
32kHz watch crystal
V
V
BAT
A
DD
DD
IN
OL(MAX)
= +25°C
= 0.4V
and V
= 2.0V
= 3.6V
, for all outputs combined should not exceed 35mA to satisfy the maxi-
DD
< V
CONDITIONS
RST
) or (STOP = 1, REGEN = 0, BOD = 1). Otherwise, this current
SS
BAT1
or V
DD
-100
22.8
22.8
59.5
MIN
100
9.5
2.0
DD
is added to I
2
= 3.3V.
. Outputs do not source/sink
32,768
1000
TYP
10.0
1.5
0.1
2.7
0.6
0.8
60
24
24
DD
.
+100
MAX
10.5
25.2
25.2
66.5
200
-30
3.5
15
±5
10
2
8
Cycles
UNITS
Years
MHz
MHz
k
ms
pF
μA
nA
μA
Hz
μA
μs
μs
μs
μs
%
V
V
V
5

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