HD6417750SF167V Renesas Electronics America, HD6417750SF167V Datasheet - Page 1052

MPU 3V 16K PB-FREE 208-QFP

HD6417750SF167V

Manufacturer Part Number
HD6417750SF167V
Description
MPU 3V 16K PB-FREE 208-QFP
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417750SF167V

Core Processor
SH-4
Core Size
32-Bit
Speed
167MHz
Connectivity
EBI/EMI, FIFO, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
28
Program Memory Type
ROMless
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.6 V ~ 2 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
208-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417750SF167V
Manufacturer:
INTERSIL
Quantity:
18 720
Part Number:
HD6417750SF167V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 22 Electrical Characteristics
Rev.7.00 Oct. 10, 2008 Page 966 of 1074
REJ09B0366-0700
Figure 22.25 Synchronous DRAM Normal Read Bus Cycle: ACT + READ Commands,
D63–D0
(read)
D63–D0
(write)
DACKn
(SA: IO ← memory)
Legend:
IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
CKIO
BANK
Precharge-sel
Address
CSn
RD/WR
RAS
CASS
DQMn
BS
CKE
Burst (RASD = 1, RCD[1:0] = 01, CAS Latency = 3)
t
t
t
t
t
t
t
t
t
AD
RWD
RWD
CSD
RASD
CASD2
WDD
DACD
Tr
RWD
Row
Row
Row
t
CASD2
Trw
t
RASD
t
Tc1
t
DQMD
AD
H/L
c0
Tc2
t
CASD2
Tc3
Tc4/Td1
t
RDS
t
t
BSD
DACD
d0
Td2
t
BSD
t
RDH
d1
Td3
t
DQMD
d2
Td4
d3
t
t
t
t
CSD
RWD
t
AD
DACD
WDD

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