DF2378RVFQ34WV Renesas Electronics America, DF2378RVFQ34WV Datasheet - Page 985

MCU 3V 512K I-TEMP PB-FREE 144-L

DF2378RVFQ34WV

Manufacturer Part Number
DF2378RVFQ34WV
Description
MCU 3V 512K I-TEMP PB-FREE 144-L
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2378RVFQ34WV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
34MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
For Use With
YLCDRSK2378 - KIT DEV EVAL H8S/2378 LCDYR0K42378FC000BA - KIT EVAL FOR H8S/2378HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)EDK2378 - DEV EVAL KIT FOR H8S/2378
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Notes: 1. Transferring the data to the on-chip RAM enables this area to be used.
Operation for Settings
of Program Parameter
Execution of
Programming
Determination of
Program Result
Operation for Program
Error
Operation for FKEY
Clear
Switching MATs by
FMATS
2. Switching FMATS by a program in the on-chip RAM enables this area to be used.
Item
On-chip
RAM
Storable/Executable Area
User
Boot
MAT
× *
×
×
×
×
×
2
Section 21 Flash Memory (0.18-μm F-ZTAT Version)
(Expanded
External
Space
Mode)
×
×
Rev.7.00 Mar. 18, 2009 page 917 of 1136
User
MAT
Selected MAT
Boot
User
MAT
REJ09B0109-0700
Storage Area
Embedded
Program

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