DF2378RVFQ34WV Renesas Electronics America, DF2378RVFQ34WV Datasheet - Page 446

MCU 3V 512K I-TEMP PB-FREE 144-L

DF2378RVFQ34WV

Manufacturer Part Number
DF2378RVFQ34WV
Description
MCU 3V 512K I-TEMP PB-FREE 144-L
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2378RVFQ34WV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
34MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
For Use With
YLCDRSK2378 - KIT DEV EVAL H8S/2378 LCDYR0K42378FC000BA - KIT EVAL FOR H8S/2378HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)EDK2378 - DEV EVAL KIT FOR H8S/2378
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Section 8 EXDMA Controller (EXDMAC)
Rev.7.00 Mar. 18, 2009 page 378 of 1136
REJ09B0109-0700
Transfer from external memory to external device with DACK
Transfer from external device with DACK to external memory
φ
Address bus
RD
WR
EDACK
Data bus
ETEND
φ
Address bus
RD
WR
EDACK
Data bus
ETEND
Figure 8.4 Example of Timing in Single Address Mode
EXDMA cycle
EXDMA cycle
EDSAR
EDDAR
Address to external memory space
RD signal to external memory space
Data output from external memory
Address to external memory space
WR signal to external memory space
Data output from external device
with DACK

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