D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 830
D12674RVFQ33D
Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet
1.D12674RVFQ33V.pdf
(981 pages)
Specifications of D12674RVFQ33D
Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D
HD6412674RVFQ33D
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 19 Flash Memory (F-ZTAT Version)
19.3
Block Configuration
Figure 19.5 shows the block configuration of 384-kbyte flash memory and figure 19.6 shows that
of 256-kbyte flash memory. The thick lines indicate erasing units, the narrow lines indicate
programming units, and the values are addresses. The 384-kbyte flash memory is divided into 64
kbytes (5 blocks), 32 kbytes (1 block), and 4 kbytes (8 blocks). The 256-kbyte flash memory is
divided into 64 kbytes (3 blocks), 32 kbytes (1 block), and 4 kbytes (8 blocks). Erasing is
performed in these divided units. Programming is performed in 128-byte units starting from an
address whose lower eight bits are H'00 or H'80.
Rev. 3.00 Mar 17, 2006 page 778 of 926
REJ09B0283-0300
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