DF2370VFQ34V Renesas Electronics America, DF2370VFQ34V Datasheet - Page 42
![IC H8S/2370 MCU FLASH 144-LQFP](/photos/12/41/124170/df2370vfq34v_sml.jpg)
DF2370VFQ34V
Manufacturer Part Number
DF2370VFQ34V
Description
IC H8S/2370 MCU FLASH 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2370VFQ34V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
34MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
For Use With
YLCDRSK2378 - KIT DEV EVAL H8S/2378 LCDYR0K42378FC000BA - KIT EVAL FOR H8S/2378HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2370VFQ34V
Manufacturer:
Exar
Quantity:
67
Company:
Part Number:
DF2370VFQ34V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 24 Power-Down Modes ........................................................................ 965
24.1 Register Descriptions ......................................................................................................... 968
24.2 Operation............................................................................................................................ 972
24.3 φ Clock Output Control...................................................................................................... 979
24.4 Usage Notes ....................................................................................................................... 979
Section 25 List of Registers............................................................................... 981
25.1 Register Addresses (Address Order) .................................................................................. 981
25.2 Register Bits....................................................................................................................... 993
25.3 Register States in Each Operating Mode.......................................................................... 1007
Section 26 Electrical Characteristics ............................................................... 1019
26.1 Electrical Characteristics for H8S/2377, H8S/2375, H8S/2373, H8S/2377R,
26.2 Electrical Characteristics for H8S/2378........................................................................... 1035
Rev.7.00 Mar. 18, 2009 page xl of lxvi
REJ09B0109-0700
24.1.1 Standby Control Register (SBYCR) ..................................................................... 968
24.1.2 Module Stop Control Registers H and L (MSTPCRH, MSTPCRL)..................... 970
24.1.3 Extension Module Stop Control Registers H and L
24.2.1 Clock Division Mode............................................................................................ 972
24.2.2 Sleep Mode ........................................................................................................... 973
24.2.3 Software Standby Mode........................................................................................ 973
24.2.4 Hardware Standby Mode ...................................................................................... 976
24.2.5 Module Stop Mode ............................................................................................... 978
24.2.6 All-Module-Clocks-Stop Mode ............................................................................ 978
24.4.1 I/O Port Status....................................................................................................... 979
24.4.2 Current Dissipation during Oscillation Stabilization Standby Period ................... 979
24.4.3 EXDMAC, DMAC, and DTC Module Stop ......................................................... 980
24.4.4 On-Chip Peripheral Module Interrupts ................................................................. 980
24.4.5 Writing to MSTPCR, EXMSTPCR ...................................................................... 980
24.4.6 Notes on Clock Division Mode............................................................................. 980
H8S/2375R, and H8S/2373R ........................................................................................... 1019
26.1.1 Absolute Maximum Ratings ............................................................................... 1019
26.1.2 DC Characteristics .............................................................................................. 1020
26.1.3 AC Characteristics .............................................................................................. 1023
26.1.4 A/D Conversion Characteristics.......................................................................... 1032
26.1.5 D/A Conversion Characteristics.......................................................................... 1032
26.1.6 Flash Memory Characteristics ............................................................................ 1033
26.1.7 Usage Note.......................................................................................................... 1034
26.2.1 Absolute Maximum Ratings ............................................................................... 1035
26.2.2 DC Characteristics .............................................................................................. 1036
(EXMSTPCRH, EXMSTPCRL) .......................................................................... 971
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