DF2370VFQ34V Renesas Electronics America, DF2370VFQ34V Datasheet - Page 242
![IC H8S/2370 MCU FLASH 144-LQFP](/photos/12/41/124170/df2370vfq34v_sml.jpg)
DF2370VFQ34V
Manufacturer Part Number
DF2370VFQ34V
Description
IC H8S/2370 MCU FLASH 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.YR0K42378FC000BA.pdf
(1208 pages)
Specifications of DF2370VFQ34V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
34MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
For Use With
YLCDRSK2378 - KIT DEV EVAL H8S/2378 LCDYR0K42378FC000BA - KIT EVAL FOR H8S/2378HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2370VFQ34V
Manufacturer:
Exar
Quantity:
67
Company:
Part Number:
DF2370VFQ34V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 242 of 1208
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Section 6 Bus Controller (BSC)
6.4.3
Memory Interfaces
The memory interfaces in this LSI comprise a basic bus interface that allows direct connection of
ROM, SRAM, and so on; a DRAM interface that allows direct connection of DRAM; a
synchronous DRAM interface that allows direct connection of synchronous DRAM; and a burst
ROM interface that allows direct connection of burst ROM. The interface can be selected
independently for each area.
An area for which the basic bus interface is designated functions as normal space, an area for
which the DRAM interface is designated functions as DRAM space, an area for which the
synchronous DRAM interface is designated functions as continuous synchronous DRAM space,
and an area for which the burst ROM interface is designated functions as burst ROM space.
The initial state of each area is basic bus interface, 3-state access space. The initial bus width is
selected according to the operating mode.
Note: The synchronous DRAM interface is not supported by the H8S/2378 Group.
Area 0: Area 0 includes on-chip ROM in expanded mode with on-chip ROM enabled and the
space excluding on-chip ROM is external address space, and in expanded mode with on-chip
ROM disabled, all of area 0 is external address space.
When area 0 external space is accessed, the CS0 signal can be output.
Either basic bus interface or burst ROM interface can be selected for area 0.
Area 1: In externally expanded mode, all of area 1 is external address space.
When area 1 external address space is accessed, the CS1 signal can be output.
Either basic bus interface or burst ROM interface can be selected for area 1.
Areas 2 to 5: In externally expanded mode, areas 2 to 5 are all external address space.
When area 2 to 5 external space is accessed, signals CS2 to CS5 can be output.
Basic bus interface, DRAM interface, or synchronous DRAM interface can be selected for areas 2
to 5. With the DRAM interface, signals CS2 and CS5 are used as RAS signals.
If areas 2 to 5 are designated as continuous DRAM space, large-capacity (e.g. 64-Mbit) DRAM
can be connected. In this case, the CS2 signal is used as the RAS signal for the continuous DRAM
space.
Rev.7.00 Mar. 18, 2009 page 174 of 1136
REJ09B0109-0700
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