S9S08SG16E1MTJ Freescale Semiconductor, S9S08SG16E1MTJ Datasheet - Page 6

• Manufacturer Part Number: S9S08SG16E1MTJ
• Description: MCU 16K FLASH 20-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of S9S08SG16E1MTJ

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, LIN, SCI, SPI
• Peripherals: LVD. POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 20-TSSOP
• Processor Series: S08SG
• Core: HCS08
• Data Bus Width: 8 bit
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Revision History
To provide the most up-to-date information, the revision of our documents on the World Wide Web will be
the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
The following revision history table summarizes changes contained in this document.
6
Revision
http://freescale.com/
Number
1
2
3
4
5
6
7
Revision
10/2007
03/2009
04/2009
10/2009
6/2007
5/2008
5/2008
Date
Updated the TPM module, incorporated minor revisions for the T
rate, FPROT and Appendix B packaging information. -SAMPLES DRAFT-
Qualify Draft includes updates to TPM module and the Electricals appendix.
Also, revised the order numbering information.
Updated some electricals and made some minor grammatical/formatting revi-
sions. Corrected the SPI block module version. Removed incorrect ADC temper-
ature sensor value from the Features section. Updated the package information
with a special mask set identifier.
Added the EMC Radiated Emissions data. Removed the Susceptibility Data.
Updated the Corporate addresses on the back cover.
Added the High Temperature Device Specifications and updated the charts.
Updated ADC characteristics for Temp Sensor Slope to be a range of
25 C–150 C , added Control Timing table row 2 to separate standard characteris-
tics from the AEC Grade 0 characteristics, and included the text, “AEC Grade 0”
to the text of footnote 3 for Table B-1 Device Numbering System. Added notes to
the ADC chapter specifying that, for this device, there are only 16 analog input
pins and consequently no APCTL3 register. Updated the Literature Request
information on the back cover.
Revised Table A-6 DC Characteristics, Row 24 Bandgap Voltage Reference for
AEC Grade 0 from 1.21V to 1.22 V. Removed AEC Grade 0 (red diamond) from
the Table A-9 ICS Frequency Specifications, Row 9 Total deviation of trimmed
DCO output frequency over voltage and temperature so that it is not listed for
AEC Grade 0.
MC9S08SG32 Data Sheet, Rev. 8
Description of Changes
Freescale Semiconductor
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