STM32F103C8T6TR STMicroelectronics, STM32F103C8T6TR Datasheet - Page 64

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STM32F103C8T6TR

Manufacturer Part Number
STM32F103C8T6TR
Description
MCU ARM 64KB FLASH MEM 48-LQFP
Manufacturer
STMicroelectronics
Series
STM32r

Specifications of STM32F103C8T6TR

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
37
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
For Use With
497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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Package characteristics
6.1
64/67
Thermal characteristics
The average chip-junction temperature, T
following equation:
Where:
P
Most of the time for the application P
may be significant if the device is configured to drive continuously external modules and/or
memories.
An approximate relationship between P
Therefore (solving equations 1 and 2):
where:
K is a constant for the particular part, which may be determined from equation (3) by
measuring P
may be obtained by solving equations (1) and (2) iteratively for any value of T
Table 46.
Symbol
I/O
JA
represents the Power Dissipation on Input and Output Pins;
T
P
P
A
JA
D
INT
is the Ambient Temperature in C,
is the sum of P
is the Package Junction-to-Ambient Thermal Resistance, in C/W,
Thermal resistance junction-ambient
LFBGA100 - 10 x 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
Thermal Resistance Junction-Ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
is the product of I
D
Thermal characteristics
(at equilibrium) for a known T
INT
K = P
and P
DD
P
T
D
J
D
and V
= K / (T
= T
x (T
Parameter
I/O
A
(P
A
DD
I/O
+ (P
+ 273°C) +
D
, expressed in Watts. This is the Chip Internal Power.
J
< P
D
= P
+ 273 °C)
D
J
and T
INT
, in degrees Celsius, may be calculated using the
x
INT
A.
and can be neglected. On the other hand, P
JA
Using this value of K, the values of P
+ P
J
)
(if P
I/O
JA
I/O
),
x P
is neglected) is given by:
D
2
(1)
(2)
(3)
Value
41
46
45
55
STM32F103xx
A
.
D
and T
°C/W
Unit
I/O
J

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