STM32F103C8T6TR STMicroelectronics, STM32F103C8T6TR Datasheet - Page 59

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STM32F103C8T6TR

Manufacturer Part Number
STM32F103C8T6TR
Description
MCU ARM 64KB FLASH MEM 48-LQFP
Manufacturer
STMicroelectronics
Series
STM32r

Specifications of STM32F103C8T6TR

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
37
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
48-LQFP
For Use With
497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STM32F103C8T6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F103C8T6TR
Manufacturer:
STM
Quantity:
12 000
Part Number:
STM32F103C8T6TR
Manufacturer:
ST
0
Part Number:
STM32F103C8T6TR
0
STM32F103xx
6
Package characteristics
Figure 27. LFBGA100 - low profile fine pitch ball grid array package outline
Table 42.
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
N (number of balls)
Dim.
LFBGA100 - low profile fine pitch ball grid array package mechanical data
0.270
C
0.45
9.85
9.85
Min
A2 A4 A3
Seating plane
A1 corner index area
B
(see note 5)
G
K
H
E
D
C
B
A
F
J
1.085
10.00
10.00
0.30
0.50
7.20
7.20
0.80
1.40
mm
Typ
1 2 3 4 5 6 7 8 9 10
e
Bottom view
D1
D
1.700
10.15
10.15
0.80
0.55
0.12
0.15
0.08
Max
F
b
eee
(100 balls)
fff
100
M
M
A1
C A B
C
F
e
0.011
0.018
0.388
0.388
A
E1
Min
E
A
ddd C
Package characteristics
ai14396
inches
0.043
0.012
0.020
0.394
0.283
0.394
0.283
0.031
0.055
Typ
0.067
0.031
0.022
0.005
0.006
0.003
0.40
0.40
Max
59/67

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