DSPIC30F4011-20I/ML Microchip Technology, DSPIC30F4011-20I/ML Datasheet - Page 174

• Manufacturer Part Number: DSPIC30F4011-20I/ML
• Description: IC DSPIC MCU/DSP 48K 44QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F4011-20I/ML

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 30
• Program Memory Size: 48KB (16K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFN
• Core Frequency: 40MHz
• Embedded Interface Type: CAN, I2C, SPI, UART
• No. Of I/o's: 30
• Flash Memory Size: 48KB
• Supply Voltage Range: 2.5V To 5.5V
• Operating Temperature Range: -40°C To
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT44QFN2 - SOCKET TRAN ICE 44QFN/40DIPAC164322 - MODULE SOCKET MPLAB PM3 28/44QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F401120/ML

dsPIC30F4011/4012
TABLE 24-2:
TABLE 24-3:
TABLE 24-4:
DS70135E-page 172
dsPIC30F401X-30I
dsPIC30F401X-20E
Power Dissipation:
Internal Chip Power Dissipation:
P
I/O Pin power dissipation:
P
Maximum Allowed Power Dissipation
Package Thermal Resistance, 28-pin SPDIP (SP)
Package Thermal Resistance, 28-pin SOIC (SO)
Package Thermal Resistance, 40-pin PDIP (P)
Package Thermal Resistance, 44-pin TQFP, 10x10x1 mm (PT)
Package Thermal Resistance, 44-pin QFN (ML)
Note 1:
DC CHARACTERISTICS
Param
Operating Voltage
DC10
DC11
DC12
DC16
DC17
Note 1:
INT
I
No.
/
O
= ∑ ({V
= V
2:
3:
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
DD X
V
V
V
V
S
Symbol
DD
DD
DR
POR
VDD
Junction to ambient thermal resistance, Theta-ja (θ
Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and
are not tested.
These parameters are characterized but not tested in manufacturing.
This is the limit to which V
DD
(I
DD
– V
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
THERMAL OPERATING CONDITIONS
– ∑ I
OH
Supply Voltage
Supply Voltage
RAM Data Retention
Voltage
V
to ensure internal
Power-on Reset signal
V
to ensure internal
Power-on Reset signal
(2)
DD
DD
}
X
OH
Start Voltage
Rise Rate
Characteristic
I
OH
)
Characteristic
(3)
) + ∑ (V
Rating
OL X
DD
can be lowered without losing RAM data.
I
OL
)
Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated)
Operating temperature
0.05
Min
2.5
3.0
—
—
Confidential
Typ
V
1.5
—
—
—
SS
(1)
JA
) numbers are achieved by package simulations.
Max
5.5
5.5
—
—
—
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
P
T
T
T
T
-40°C ≤ T
-40°C ≤ T
JA
JA
JA
JA
JA
A
A
D
J
J
Units
V/ms 0-5V in 0.1 sec,
V
V
V
V
Min
Typ
-40
-40
-40
-40
A
A
Industrial temperature
Extended temperature
0-3V in 60 ms
41
45
37
40
28
≤ +85°C for Industrial
≤ +125°C for Extended
(T
© 2007 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
+ P
A
Conditions
)/θ
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1