MC56F8013VFAE Freescale Semiconductor, MC56F8013VFAE Datasheet - Page 95

• Manufacturer Part Number: MC56F8013VFAE
• Description: IC DIGITAL SIGNAL CTLR 32-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8013VFAE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 26
• Program Memory Size: 16KB (8K x 16)
• Program Memory Type: FLASH
• Ram Size: 2K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 32-LQFP
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: MC56F80xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 32 MIPs
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 26
• Data Ram Size: 4 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Data Rom Size: 16 KB
• Development Tools By Supplier: MC56F8037EVM, DEMO56F8014-EE, DEMO56F8013-EE
• Interface Type: SCI, SPI, I2C
• Minimum Operating Temperature: - 40 C
• For Use With: CPA56F8013 - BOARD SOCKET FOR MC56F8013APMOTOR56F8000E - KIT DEMO MOTOR CTRL SYSTEMDEMO56F8013-EE - BOARD DEMO FOR 56F8013
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Default Mode
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2: RESET, GPIOA7
Pin Group 3: ADC Analog Inputs
10.1.1
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESC51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per
7. See
Freescale Semiconductor
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
top surface of the board near the package.
1012.1).
JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Section 12.1
Junction to ambient
Natural convection
Junction to ambient
Natural convection
Junction to ambient
(@200 ft/min)
Junction to ambient
(@200 ft/min)
Junction to board
Junction to case
Junction to package top
ESD for Human Body Model (HBM)
ESD for Machine Model (MM)
ESD for Charge Device Model (CDM)
ElectroStatic Discharge (ESD) Model
Characteristic
for more details on thermal design considerations.
Table 10-3 LQFP Package Thermal Characteristics
Characteristic
Table 10-2 56F8013/56F8011 ESD Protection
Single layer board
(1s)
Four layer board
(2s2p)
Single layer board
(1s)
Four layer board
(2s2p)
Natural Convection
56F8013/56F8011 Data Sheet, Rev. 12
Comments
2000
Min
200
750
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJMA
θJC
θJA
θJB
JT
Typ
—
—
—
(LQFP)
Value
74
50
67
46
23
20
4
Max
—
—
—
6
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
General Characteristics
V
V
V
Notes
1,2
1,3
1,3
1,3
4
5
6
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