LPC1113FHN33/301,5 NXP Semiconductors, LPC1113FHN33/301,5 Datasheet - Page 30

• Manufacturer Part Number: LPC1113FHN33/301,5
• Description: IC MCU 32BIT 24KB FLASH 33HVQFN
• Manufacturer: NXP Semiconductors
• Series: LPC1100r

Specifications of LPC1113FHN33/301,5

• Program Memory Type: FLASH
• Program Memory Size: 24KB (24K x 8)
• Package / Case: 33-VQFN Exposed Pad, 33-HVQFN, 33-SQFN, 33-DHVQFN
• Core Processor: ARM Cortex-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 28
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC11
• Core: ARM Cortex M0
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SPI, UART
• Number Of Programmable I/os: 28
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: LPC1100
• Device Core: ARM Cortex M0
• Device Core Size: 32b
• Frequency (max): 50MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 42
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 33
• Package Type: HVQFN EP
• Package: 33HVQFN EP
• Family Name: LPC1100
• Maximum Speed: 50 MHz
• Number Of Timers: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4951; 935290776551

NXP Semiconductors
9. Static characteristics
Table 7.
T
LPC1111_12_13_14
Product data sheet
Symbol
V
I
Standard port pins, RESET
I
I
I
V
V
V
V
V
V
V
DD
IL
IH
OZ
amb
DD
I
O
IH
IL
hys
OH
OL
= −40 °C to +85 °C, unless otherwise specified.
Static characteristics
Parameter
supply voltage (core
and external rail)
supply current
LOW-level input current V
HIGH-level input
current
OFF-state output
current
input voltage
output voltage
HIGH-level input
voltage
LOW-level input voltage
hysteresis voltage
HIGH-level output
voltage
LOW-level output
voltage
All information provided in this document is subject to legal disclaimers.
Conditions
Active mode; code
executed from flash
Sleep mode;
Deep-sleep mode;
V
Deep power-down mode;
V
resistor disabled
V
pull-down resistor
disabled
V
on-chip pull-up/down
resistors disabled
pin configured to provide
a digital function
output active
2.0 V ≤ V
I
1.8 V ≤ V
I
2.0 V ≤ V
I
1.8 V ≤ V
I
OH
OH
OL
OL
DD
DD
I
I
O
system clock = 12 MHz
system clock = 50 MHz
system clock = 12 MHz
= 0 V; on-chip pull-up
= V
= 0 V; V
= 4 mA
= 3 mA
= −4 mA
= −3 mA
while(1){}
V
V
V
= 3.3 V
= 3.3 V
DD
DD
DD
DD
Rev. 2 — 18 August 2010
; on-chip
= 3.3 V
= 3.3 V
= 3.3 V
DD
DD
DD
DD
O
≤ 3.6 V;
< 2.0 V;
≤ 3.6 V;
< 2.0 V;
= V
DD
;
[2][3][4]
[2][3][5]
[2][3][4]
[2][3][8]
[10][11]
[5][6]
[6][7]
[5][6]
[2][9]
[12]
32-bit ARM Cortex-M0 microcontroller
Min
1.8
-
-
-
-
-
-
-
-
0
0
0.7V
-
-
V
V
-
-
DD
DD
LPC1111/12/13/14
− 0.4
− 0.4
DD
Typ
3.3
3
9
2
6
220
0.5
0.5
0.5
-
-
-
-
0.4
-
-
-
-
[1]
© NXP B.V. 2010. All rights reserved.
Max
3.6
-
-
-
-
-
10
10
10
5.0
V
-
0.3V
-
-
-
0.4
0.4
DD
DD
30 of 60
Unit
V
mA
mA
mA
μA
nA
nA
nA
nA
V
V
V
V
V
V
V
V
V