LPC1113FHN33/301,5 NXP Semiconductors, LPC1113FHN33/301,5 Datasheet - Page 29

• Manufacturer Part Number: LPC1113FHN33/301,5
• Description: IC MCU 32BIT 24KB FLASH 33HVQFN
• Manufacturer: NXP Semiconductors
• Series: LPC1100r

Specifications of LPC1113FHN33/301,5

• Program Memory Type: FLASH
• Program Memory Size: 24KB (24K x 8)
• Package / Case: 33-VQFN Exposed Pad, 33-HVQFN, 33-SQFN, 33-DHVQFN
• Core Processor: ARM Cortex-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 28
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC11
• Core: ARM Cortex M0
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SPI, UART
• Number Of Programmable I/os: 28
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Cpu Family: LPC1100
• Device Core: ARM Cortex M0
• Device Core Size: 32b
• Frequency (max): 50MHz
• Total Internal Ram Size: 8KB
• # I/os (max): 42
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 33
• Package Type: HVQFN EP
• Package: 33HVQFN EP
• Family Name: LPC1100
• Maximum Speed: 50 MHz
• Number Of Timers: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4951; 935290776551

NXP Semiconductors
8. Limiting values
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
LPC1111_12_13_14
Product data sheet
Symbol
V
V
I
I
I
T
T
P
V
DD
SS
latch
stg
j(max)
DD
I
tot(pack)
ESD
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
Including voltage on outputs in 3-state mode.
The peak current is limited to 25 times the corresponding maximum current.
Dependent on package type.
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
otherwise noted.
Limiting values
Parameter
supply voltage (core and external rail)
input voltage
supply current
ground current
I/O latch-up current
storage temperature
maximum junction temperature
total power dissipation (per package)
electrostatic discharge voltage
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 18 August 2010
Conditions
5 V tolerant I/O
pins; only valid
when the V
supply voltage is
present
per supply pin
per ground pin
−(0.5V
(1.5V
T
based on package
heat transfer, not
device power
consumption
human body
model; all pins
j
< 125 °C
DD
DD
);
) < V
DD
[1]
I
<
32-bit ARM Cortex-M0 microcontroller
LPC1111/12/13/14
[2]
[3]
[3]
[4]
[5]
Min
1.8
−0.5
-
-
-
−65
-
-
−6500
Max
3.6
+5.5
100
100
100
+150
150
1.5
+6500
© NXP B.V. 2010. All rights reserved.
SS
unless
Unit
V
V
°C
°C
W
V
mA
mA
mA
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