LPC2387FBD100,551 NXP Semiconductors, LPC2387FBD100,551 Datasheet - Page 59

• Manufacturer Part Number: LPC2387FBD100,551
• Description: IC ARM7 MCU FLASH 512K 100LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2387FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2387, MCB2387U, MCB2387UME
• Development Tools By Supplier: OM11013
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Cpu Family: LPC2000
• Device Core: ARM7TDMI-S
• Device Core Size: 16/32Bit
• Frequency (max): 72MHz
• Total Internal Ram Size: 98KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4359 - BOARD EVAL FOR LPC2387568-4310 - EVAL BOARD LPC2158 W/LCD568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 568-4322; 935284932551; LPC2387FBD100-S

NXP Semiconductors
16. Abbreviations
LPC2387
Product data sheet
Table 17.
Acronym
ADC
AHB
AMBA
APB
BOD
CAN
DAC
DCC
DMA
DSP
EOP
ETM
GP
GPIO
IrDA
JTAG
MII
MIIM
PHY
PLL
PWM
RMII
SE0
SPI
SSI
SSP
TTL
UART
USB
Abbreviations
All information provided in this document is subject to legal disclaimers.
Description
Analog-to-Digital Converter
Advanced High-performance Bus
Advanced Microcontroller Bus Architecture
Advanced Peripheral Bus
BrownOut Detection
Controller Area Network
Digital-to-Analog Converter
Debug Communication Channel
Direct Memory Access
Digital Signal Processing
End Of Packet
Embedded Trace Macrocell
General Purpose
General Purpose Input/Output
Infrared Data Association
Joint Test Action Group
Media Independent Interface
Media Independent Interface Management
Physical Layer
Phase-Locked Loop
Pulse Width Modulator
Reduced Media Independent Interface
Single Ended Zero
Serial Peripheral Interface
Serial Synchronous Interface
Synchronous Serial Port
Transistor-Transistor Logic
Universal Asynchronous Receiver/Transmitter
Universal Serial Bus
Rev. 4 — 10 February 2011
Single-chip 16-bit/32-bit MCU
LPC2387
© NXP B.V. 2011. All rights reserved.
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