LPC2387FBD100,551 NXP Semiconductors, LPC2387FBD100,551 Datasheet - Page 42
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LPC2387FBD100,551
Manufacturer Part Number
LPC2387FBD100,551
Description
IC ARM7 MCU FLASH 512K 100LQFP
Manufacturer
NXP Semiconductors
Series
LPC2300r
Specifications of LPC2387FBD100,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
100-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
70
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC23
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
70
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2387, MCB2387U, MCB2387UME
Development Tools By Supplier
OM11013
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Cpu Family
LPC2000
Device Core
ARM7TDMI-S
Device Core Size
16/32Bit
Frequency (max)
72MHz
Total Internal Ram Size
98KB
# I/os (max)
70
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Package Type
LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4359 - BOARD EVAL FOR LPC2387568-4310 - EVAL BOARD LPC2158 W/LCD568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
Other names
568-4322
935284932551
LPC2387FBD100-S
935284932551
LPC2387FBD100-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2387FBD100,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
LPC2387
Product data sheet
Fig 8.
Fig 9.
I
DD(DCDC)dpd(3v3)
(μA)
I
BAT
100
(μA)
40
30
20
10
80
60
40
20
RTC battery maximum supply current I
power-down mode
V
Total DC-to-DC converter maximum supply current I
temperature in Deep power-down mode
V
0
0
−40
−40
DD(3V3)
DD(3V3)
V
V
DD(DCDC)(3V3)
DD(DCDC)(3V3)
All information provided in this document is subject to legal disclaimers.
= V
= V
i(VBAT)
DD(DCDC)(3V3)
Rev. 4 — 10 February 2011
−15
−15
= 3.3 V; T
V
V
= 3.0 V
= 3.3 V
i(VBAT)
i(VBAT)
= 3.3 V; T
= 3.3 V
= 3.0 V
amb
= 25 °C.
10
10
amb
= 25 °C
BAT
35
35
versus temperature in Deep
Single-chip 16-bit/32-bit MCU
DD(DCDC)dpd(3V3)
60
60
temperature (°C)
temperature (°C)
LPC2387
002aae047
002aae048
© NXP B.V. 2011. All rights reserved.
versus
85
85
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