LPC2387FBD100,551 NXP Semiconductors, LPC2387FBD100,551 Datasheet - Page 13

• Manufacturer Part Number: LPC2387FBD100,551
• Description: IC ARM7 MCU FLASH 512K 100LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2387FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2387, MCB2387U, MCB2387UME
• Development Tools By Supplier: OM11013
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Cpu Family: LPC2000
• Device Core: ARM7TDMI-S
• Device Core Size: 16/32Bit
• Frequency (max): 72MHz
• Total Internal Ram Size: 98KB
• # I/os (max): 70
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4359 - BOARD EVAL FOR LPC2387568-4310 - EVAL BOARD LPC2158 W/LCD568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 568-4322; 935284932551; LPC2387FBD100-S

NXP Semiconductors
Table 3.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] If the RTC is not used, these pins can be left floating.
[11] Pad provides special analog functionality.
[12] Pad provides special analog functionality.
[13] Pad provides special analog functionality.
[14] Pad provides special analog functionality.
[15] Pad provides special analog functionality.
7. Functional description
LPC2387
Product data sheet
Symbol
V
VREF
VBAT
DDA
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a DAC input,
digital section of the pad is disabled.
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
Open-drain 5 V tolerant digital I/O pad, compatible with I
output functionality. When power is switched off, this pin connected to the I
Open-drain configuration applies to all functions on this pin.
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only).
5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis
Pad provides special analog functionality.
When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding
is preferred to reduce susceptibility to noise). XTAL2 should be left floating.
Pin description
7.1 Architectural overview
Pin
10
12
19
The LPC2387 microcontroller consists of an ARM7TDMI-S CPU with emulation support,
the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip
memory, the AMBA AHB interfacing to high-speed on-chip peripherals, and the AMBA
APB for connection to other on-chip peripheral functions. The microcontroller permanently
configures the ARM7TDMI-S processor for little-endian byte order.
The LPC2387 implements two AHB in order to allow the Ethernet block to operate without
interference caused by other system activity. The primary AHB, referred to as AHB1,
includes the VIC and GPDMA controller.
The second AHB, referred to as AHB2, includes only the Ethernet block and an
associated 16 kB SRAM. In addition, a bus bridge is provided that allows the secondary
AHB to be a bus master on AHB1, allowing expansion of Ethernet buffer space into
off-chip memory or unused space in memory residing on AHB1.
[15]
[15]
[15]
…continued
Type
I
I
I
All information provided in this document is subject to legal disclaimers.
Description
analog 3.3 V pad supply voltage: This should be nominally the same voltage
as V
used to power the ADC and DAC.
ADC reference: This should be nominally the same voltage as V
should be isolated to minimize noise and error. Level on this pin is used as a
reference for ADC and DAC.
RTC pin power supply: 3.3 V on this pin supplies the power to the RTC
peripheral.
DD(3V3)
Rev. 4 — 10 February 2011
2
but should be isolated to minimize noise and error. This voltage is
C-bus 400 kHz specification. This pad requires an external pull-up to provide
2
C-bus is floating and does not disturb the I
Single-chip 16-bit/32-bit MCU
LPC2387
© NXP B.V. 2011. All rights reserved.
DD(3V3)
2
C lines.
but
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