LPC2361FBD100,551 NXP Semiconductors, LPC2361FBD100,551 Datasheet - Page 57

• Manufacturer Part Number: LPC2361FBD100,551
• Description: IC ARM7 MCU FLASH 64K 100LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2361FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 34 KB
• Interface Type: CAN/I2S/SPI/SSP/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 100LQFP
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4525; 935286991551

NXP Semiconductors
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Package outline . . . . . . . . . . . . . . . . . . . . . . . . 51
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 53
Legal information. . . . . . . . . . . . . . . . . . . . . . . 54
Contact information. . . . . . . . . . . . . . . . . . . . . 55
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 54
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Single-chip 16-bit/32-bit MCU
LPC2361/62
Document identifier: LPC2361_62_4
Date of release: 4 March 2010
All rights reserved.