LPC2361FBD100,551 NXP Semiconductors, LPC2361FBD100,551 Datasheet - Page 53

• Manufacturer Part Number: LPC2361FBD100,551
• Description: IC ARM7 MCU FLASH 64K 100LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2361FBD100,551

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 100-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 34K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 34 KB
• Interface Type: CAN/I2S/SPI/SSP/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 70
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 6-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 100LQFP
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCDMCB2360UME - BOARD EVAL MCB2360 + ULINK-MEMCB2360U - BOARD EVAL MCB2360 + ULINK2568-4014 - BOARD EVAL FOR LPC236X ARM568-3999 - BOARD EVAL FOR LPC23 ARM MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4525; 935286991551

NXP Semiconductors
16. Revision history
Table 12.
LPC2361_62_4
Product data sheet
Document ID
LPC2361_62_4
Modifications:
LPC2361_62_3
Modifications:
LPC2361_62_2
Modifications:
LPC2361_62_1
Revision history
Release date
20100304
20081111
20081016
20080804
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Table 3 “Pin
Table 4 “Limiting
Table 5 “Static
Table 5 “Static
Table 5 “Static
I
Table 6 “Dynamic
Added
Added
Section 7.2 “On-chip flash programming
endurance minimum specs.
Added
Section 7.24.2 “Brownout
Added
Added
Added
Added
Figure 13 “ADC
Figure 3: corrected memory map.
Clarify Ethernet availability between devices throughout data sheet.
Section 2 and Section 7.3: clarify SRAM size difference between devices.
Table 2: add table note to clarify Ethernet SRAM usage, changed orientation from
landscape to portrait.
Table 5: removed table note “Includes external resistors...”.
Table 5: removed row R
Table 5: V
Table 5: V
Table 5: I
Figure 6: removed figure note row “V
DD(DCDC)dpd(3V3)
Table 8 “Dynamic characteristics of
Table 10 “DAC electrical
Section 7.23.4.4 “Deep power-down
Section 9.1 “Power-down
Section 9.2 “Deep power-down
Section 13.2 “XTAL1
Section 13.3 “XTAL and RTC Printed Circuit Board (PCB) layout
OHS
I
hys
, added Table note 6.
description”: Added table note for XTAL1 and XTAL2 pins.
, moved 0.4 from Typ to Min column.
, I
Rev. 04 — 4 March 2010
characteristics”: Updated min, typical and max values for oscillator pins.
OLS
characteristics”: Added table note for Z
characteristics”: Updated conditions and typical values for
, I
characteristics”: Changed V
Data sheet status
Product data sheet
Product data sheet
Product data sheet
Product data sheet
values”: Changed V
BATact
characteristics”: Added ARM processor clock frequency information.
, updated Table note 8.
, and I
pu
.
detection”: Changed V
input”.
BAT
characteristics”.
.
mode”.
DD
ESD
mode”.
= 1.8 V”.
memory”: Removed text regarding flash
min/max to −2500/+2500.
flash”.
mode”.
DDA
Change notice
-
-
-
-
to V
DD(3V3)
Single-chip 16-bit/32-bit MCU
i(VREF)
DRV
to V
.
.
LPC2361/62
DD(DCDC)(3V3)
Supersedes
LPC2361_62_3
LPC2361_62_2
LPC2361_62_1
-
© NXP B.V. 2010. All rights reserved.
guidelines”.
.
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