AT90USB646-MU Atmel, AT90USB646-MU Datasheet - Page 30

• Manufacturer Part Number: AT90USB646-MU
• Description: IC AVR MCU 64K 64QFN
• Manufacturer: Atmel
• Series: AVR® 90USBr

Specifications of AT90USB646-MU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 48
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-VQFN Exposed Pad, 64-HVQFN, 64-SQFN, 64-DHVQFN
• Processor Series: 90USB
• Core: AVR
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: SPI, TWI, USART, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 48
• Number Of Timers: 4
• Operating Supply Voltage: 5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 85 C
• Cpu Family: AT90
• Device Core: AVR
• Device Core Size: 8b
• Frequency (max): 20MHz
• Total Internal Ram Size: 4KB
• # I/os (max): 48
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Package Type: QFN EP
• For Use With: ATSTK600-TQFP64 - STK600 SOCKET/ADAPTER 64-TQFP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATSTK525 - KIT STARTER FOR AT90USBAT90USBKEY2 - KIT DEMO FOR AT90USB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: AT90USB646-16MU; AT90USB646-16MU

5.5
5.5.1
5.5.2
30
External Memory Interface
AT90USB64/128
Overview
Using the External Memory Interface
With all the features the External Memory Interface provides, it is well suited to operate as an
interface to memory devices such as External SRAM and Flash, and peripherals such as LCD-
display, A/D, and D/A. The main features are:
•
•
•
•
When the eXternal MEMory (XMEM) is enabled, address space outside the internal SRAM
becomes available using the dedicated External Memory pins (see
10-3 on page
Figure 5-4.
The interface consists of:
The control bits for the External Memory Interface are located in two registers, the External
Memory Control Register A – XMCRA, and the External Memory Control Register B – XMCRB.
• AD7:0: Multiplexed low-order address bus and data bus.
• A15:8: High-order address bus (configurable number of bits).
• ALE: Address latch enable.
• RD: Read strobe.
• WR: Write strobe.
Four different wait-state settings (including no wait-state).
Independent wait-state setting for different external Memory sectors (configurable sector size).
The number of bits dedicated to address high byte is selectable.
Bus keepers on data lines to minimize current consumption (optional).
79, and
External Memory with Sector Select
Table 10-9 on page
E xternal M emory
(0-60K x 8)
M emory C onfiguration A
83). The memory configuration is shown in
I nternal memory
L ower sector
U pper sector
SRW01
SRW00
SRW11
SRW10
0 x 0000
ISRAM end
XMem start
0 x FFFF
SRL[2..0]
Figure 2-1 on page
7593K–AVR–11/09
Figure
5,
Table
5-4.