AT90USB646-MU Atmel, AT90USB646-MU Datasheet - Page 276

• Manufacturer Part Number: AT90USB646-MU
• Description: IC AVR MCU 64K 64QFN
• Manufacturer: Atmel
• Series: AVR® 90USBr

Specifications of AT90USB646-MU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: EBI/EMI, I²C, SPI, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 48
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-VQFN Exposed Pad, 64-HVQFN, 64-SQFN, 64-DHVQFN
• Processor Series: 90USB
• Core: AVR
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: SPI, TWI, USART, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 48
• Number Of Timers: 4
• Operating Supply Voltage: 5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 85 C
• Cpu Family: AT90
• Device Core: AVR
• Device Core Size: 8b
• Frequency (max): 20MHz
• Total Internal Ram Size: 4KB
• # I/os (max): 48
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Package Type: QFN EP
• For Use With: ATSTK600-TQFP64 - STK600 SOCKET/ADAPTER 64-TQFP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATSTK525 - KIT STARTER FOR AT90USBAT90USBKEY2 - KIT DEMO FOR AT90USB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: AT90USB646-16MU; AT90USB646-16MU

22.14.1.1
22.15 Isochronous mode
22.15.1
276
AT90USB64/128
Underflow
Abort
If the endpoint uses 2 banks, the second one can be read by the HOST while the current is
being written by the CPU. Then, when the CPU clears FIFOCON, the next bank may be already
ready (free) and TXINI is set immediately.
An “abort” stage can be produced by the host in some situations:
The KILLBK bit is used to kill the last “written” bank. The best way to manage this abort is to per-
form the following operations:
Table 22-1.
An underflow can occur during IN stage if the host attempts to read a bank which is empty. In
this situation, the UNDERFI interrupt is triggered.
An underflow can also occur during OUT stage if the host send a packet while the banks are
already full. Typically, he CPU is not fast enough. The packet is lost.
It is not possible to have underflow error during OUT stage, in the CPU side, since the CPU
should read only if the bank is ready to give data (RXOUTI=1 or RWAL=1)
• after “N” write into UEDATX
• as soon as RWAL is cleared by hardware.
• In a control transaction: ZLP data OUT received during a IN stage,
• In an isochronous IN transaction: ZLP data OUT received on the OUT endpoint during a IN
• ...
stage on the IN endpoint
Abort flow
Abort done
NBUSYBK
UEIENX.
Endpoint
Endpoint
TXINE
Abort
Clear
reset
=0
Yes
No
Yes
KILLBK=1
KILLBK=1
No
Disable the TXINI interrupt.
Abort is based on the fact
that no banks are busy,
meaning that nothing has to
be sent.
Kill the last written
bank.
Wait for the end of the
procedure.
7593K–AVR–11/09