PIC24FJ128GA010-I/PT Microchip Technology, PIC24FJ128GA010-I/PT Datasheet - Page 219

• Manufacturer Part Number: PIC24FJ128GA010-I/PT
• Description: IC PIC MCU FLASH 128K 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ128GA010-I/PT

• Core Size: 16-Bit
• Program Memory Size: 128KB (43K x 24)
• Core Processor: PIC
• Speed: 16MHz
• Connectivity: I²C, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TFQFP
• Controller Family/series: PIC24
• No. Of I/o's: 84
• Ram Memory Size: 8KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• No. Of Pwm Channels: 5
• Embedded Interface Type: EUART, I2C, PSP, SPI
• Rohs Compliant: Yes
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: SPI, I2C, USART
• Maximum Clock Frequency: 16 MHz
• Number Of Programmable I/os: 54
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• Package: 100TQFP
• Device Core: PIC
• Family Name: PIC24
• Maximum Speed: 16 MHz
• Operating Supply Voltage: 2.5|3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM240011 - KIT STARTER MPLAB FOR PIC24F MCUAC164333 - MODULE SKT FOR PM3 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2MA160011 - DAUGHTER BOARD PICDEM LCD 16F91XDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

100-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
© 2005 Microchip Technology Inc.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-110
B
*Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
p
c
§
#leads=n1
Dimension Limits
E1
E
Units
A2
(F)
D1
n1
A1
E1
E
D
B
n
p
A
L
c
Advance Information
L
n
MIN
.037
.002
.018
.004
.007
11
11
2
1
0
D1
PIC24FJ128GA FAMILY
INCHES
.630 BSC
.630 BSC
.551 BSC
.551 BSC
NOM
D
100
A1
.020
.039
.024
.039
.009
3.5
25
12
12
A
MAX
.047
.006
.030
.008
.041
.011
(F)
13
13
7
MIN
0.95
0.05
0.45
0.09
0.17
11
11
0
MILLIMETERS*
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
NOM
100
0.50
1.00
0.60
1.00
0.22
3.5
25
12
12
DS39747A-page 217
MAX
A2
1.20
1.05
0.15
0.75
0.20
0.27
13
13
7