DSPIC30F3010-30I/SO Microchip Technology, DSPIC30F3010-30I/SO Datasheet - Page 50
![IC DSPIC MCU/DSP 24K 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
DSPIC30F3010-30I/SO
Manufacturer Part Number
DSPIC30F3010-30I/SO
Description
IC DSPIC MCU/DSP 24K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F3010-30ISO.pdf
(228 pages)
2.DSPIC30F3010-30ISO.pdf
(18 pages)
3.DSPIC30F3010-30ISO.pdf
(6 pages)
4.DSPIC30F3010-30ISO.pdf
(16 pages)
5.DSPIC30F3010-30ISO.pdf
(22 pages)
6.DSPIC30F3014-30IP.pdf
(244 pages)
Specifications of DSPIC30F3010-30I/SO
Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Eeprom Size
1K x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Data Ram Size
1 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F301030ISO
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F3010-30I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- DSPIC30F3010-30ISO PDF datasheet
- DSPIC30F3010-30ISO PDF datasheet #2
- DSPIC30F3010-30ISO PDF datasheet #3
- DSPIC30F3010-30ISO PDF datasheet #4
- DSPIC30F3010-30ISO PDF datasheet #5
- DSPIC30F3014-30IP PDF datasheet #6
- Current page: 50 of 244
- Download datasheet (7Mb)
dsPIC30F
FIGURE 4-2:
4.4.3
Modulo addressing can be applied to the effective
address (EA) calculation associated with any W regis-
ter. It is important to realize that the address bound-
aries check for addresses less than or greater than the
upper (for incrementing buffers) and lower (for decre-
menting buffers) boundary addresses (not just equal
to). Address changes may, therefore, jump over bound-
aries and still be adjusted correctly (see Section 4.4.4
for restrictions).
DS70082G-page 48
Note:
Byte
Address
0x11D0
0x11FF
MODULO ADDRESSING
APPLICABILITY
The modulo corrected effective address is
written back to the register only when Pre-
Modify or Post-Modify Addressing mode is
used to compute the Effective Address.
When an address offset (e.g., [W7+W2]) is
used, modulo address correction is per-
formed, but the contents of the register
remains unchanged.
Start Addr = 0x11D0
End Addr = 0x11FF
Length = 0x0018 words
DECREMENTING BUFFER MODULO ADDRESSING OPERATION EXAMPLE
MOV
MOV
MOV
MOV
MOV
MOV
MOV
MOV
DO
MOV
AGAIN: DEC
Preliminary
#0x11D0,W0
#0, XMODSRT
0x11FF,W0
W0,XMODEND
#0x8001,W0
W0,MODCON
#0x000F,W0
#0x11E0,W1
AGAIN,#0x17
W0, [W1--]
W0,W0
4.4.4
For an incrementing buffer the circular buffer start
address (lower boundary) is arbitrary, but must be at a
‘zero’ power-of-two boundary (see Section 4.4.1). For
a decrementing buffer, the circular buffer end address
is arbitrary, but must be at a ‘ones’ boundary.
There are no restrictions regarding how much an EA
calculation can exceed the address boundary being
checked and still be successfully corrected.
;set modulo start address
;set modulo end address
;enable W1, X AGU for modulo
;W0 holds buffer fill value
;point W1 to buffer
;fill the 24 buffer locations
;fill the next location
;decrement the fill value
MODULO ADDRESSING
RESTRICTIONS
2004 Microchip Technology Inc.
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