DSPIC30F3010-30I/SO Microchip Technology, DSPIC30F3010-30I/SO Datasheet - Page 181
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DSPIC30F3010-30I/SO
Manufacturer Part Number
DSPIC30F3010-30I/SO
Description
IC DSPIC MCU/DSP 24K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F3010-30ISO.pdf
(228 pages)
2.DSPIC30F3010-30ISO.pdf
(18 pages)
3.DSPIC30F3010-30ISO.pdf
(6 pages)
4.DSPIC30F3010-30ISO.pdf
(16 pages)
5.DSPIC30F3010-30ISO.pdf
(22 pages)
6.DSPIC30F3014-30IP.pdf
(244 pages)
Specifications of DSPIC30F3010-30I/SO
Program Memory Type
FLASH
Program Memory Size
24KB (8K x 24)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Eeprom Size
1K x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Data Ram Size
1 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F301030ISO
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F3010-30I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
24.0
This section provides an overview of dsPIC30F electrical characteristics. Additional information will be provided in future
revisions of this document as it becomes available.
For detailed information about the dsPIC30F architecture and core, refer to dsPIC30F Family Reference Manual
(DS70046).
Absolute maximum ratings for the dsPIC30F family are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions above
the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on MCLR with respect to V
Total power dissipation (Note 2) ...............................................................................................................................1.0W
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports ..................................................................................................................200 mA
2004 Microchip Technology Inc.
†
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
Note 1: Power dissipation is calculated as follows:
Note: All peripheral electrical characteristics are specified. For exact peripherals available on specific
2: Voltage spikes below V
ELECTRICAL CHARACTERISTICS
Pdis = V
Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/V
than pulling this pin directly to V
devices, please refer the the Family Cross Reference Table.
DD
with respect to V
DD
IK
OK
x {I
(V
DD
SS
I
(V
DD
< 0 or V
pin ..............................................................................................................................250 mA
O
pin ...........................................................................................................................300 mA
– ∑ I
< 0 or V
SS
OH
I
SS
SS
SS
> V
(†)
......................................................................................................... -0.3V to +5.5V
} + ∑ {(V
at the MCLR/V
(Note 1) ......................................................................................... 0V to +13.25V
O
(except V
DD
> V
) ..........................................................................................................±20 mA
SS
DD
DD
.
) ................................................................................................... ±20 mA
DD
– V
Preliminary
and MCLR) ................................................... -0.3V to (V
OH
PP
) x I
pin, inducing currents greater than 80 mA, may cause latchup.
OH
} + ∑(V
O
l x I
OL
)
dsPIC30F
DS70082G-page 179
PP
DD
pin, rather
+ 0.3V)