PIC18LF6310-I/PT Microchip Technology, PIC18LF6310-I/PT Datasheet - Page 385

IC PIC MCU FLASH 4KX16 64TQFP

PIC18LF6310-I/PT

Manufacturer Part Number
PIC18LF6310-I/PT
Description
IC PIC MCU FLASH 4KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18LF6310-I/PT

Core Size
8-Bit
Program Memory Size
8KB (4K x 16)
Oscillator Type
Internal
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
54
Program Memory Type
FLASH
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 12x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Controller Family/series
PIC18
No. Of I/o's
54
Ram Memory Size
768Byte
Cpu Speed
40MHz
No. Of Timers
4
No. Of Pwm
RoHS Compliant
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18LF6310-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
© 2007 Microchip Technology Inc.
80-Lead Plastic Thin Quad Flatpack (PT) – 12x12x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
PIC18F6310/6410/8310/8410
Dimension Limits
Preliminary
E1
φ
NOTE 2
Units
L
A2
A1
L1
E1
D1
N
A
E
D
e
L
φ
c
b
α
β
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
MILLIMETERS
L1
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.60
0.22
3.5°
12°
12°
80
Microchip Technology Drawing C04-092B
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
A2
DS39635B-page 383
α

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