PIC18F24J10-I/SP Microchip Technology, PIC18F24J10-I/SP Datasheet - Page 28

• Manufacturer Part Number: PIC18F24J10-I/SP
• Description: IC PIC MCU FLASH 8KX16 28-DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F24J10-I/SP

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 21
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SPIC/I2C/EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM183032, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 10-bit
• Package: 28SPDIP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162074 - HEADER INTRFC MPLAB ICD2 44TQFPAC162067 - HEADER INTRFC MPLAB ICD2 40/28P
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F45J10 FAMILY
2.6
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
Section 3.0 “Oscillator Configurations” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator
circuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a
two-sided board, avoid any traces on the other side of
the board where the crystal is placed. A suggested
layout is shown in Figure 2-4.
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
• AN826, “Crystal Oscillator Basics and Crystal
• AN849, “Basic PICmicro
• AN943, “Practical PICmicro
• AN949, “Making Your Oscillator Work”
DS39682E-page 26
Selection for rfPIC™ and PICmicro
and Design”
External Oscillator Pins
secondary
®
Oscillator Design”
®
oscillator
Oscillator Analysis
®
Devices”
(refer
to
FIGURE 2-4:
2.7
Unused I/O pins should be configured as outputs and
driven to a logic low state. Alternatively, connect a 1 kΩ
to 10 kΩ resistor to V
output to logic low.
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
Unused I/Os
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
SS
© 2009 Microchip Technology Inc.
on unused pins and drive the
13
14
15
16
17
18
19
20