PIC16F506-I/SL Microchip Technology, PIC16F506-I/SL Datasheet - Page 117

• Manufacturer Part Number: PIC16F506-I/SL
• Description: IC PIC MCU FLASH 1KX14 14SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F506-I/SL

• Program Memory Type: FLASH
• Program Memory Size: 1.5KB (1K x 12)
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: POR, WDT
• Number Of I /o: 11
• Ram Size: 67 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 67 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 3-ch x 8-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC12F510/16F506
APPENDIX A:
REVISION HISTORY
Revision A
Original release.
Revision B
Page 3 – Special Microcontroller Features and Low-
Power Features sections.
PIC12F510 Pin Diagram.
Section 3.0 – Figure 3-1, Figure 3-2, Table 3-2,
Table 3-3.
Section 4.0 – First paragraph, Section 4.2 - Figure
references, Tables 4-1 and 4-2 (Note 1).
Section 5.0 – Table 5-2, Table 5-6 Title.
Section 6.0
Section 7.0 – First paragraph, Section 7.7, Register
7-1, Register 7-2, Register 7-3, Figure 7-1, Figure 7-2,
Sections 7.4 through 7.7, Table 7-1.
Section 8.0 – Sections 8.0 through 8.2, Figure 8-1,
Table 8-1.
Section 9.0 – Table 9-2, Register 9-1, Register 9-2,
Table 9-3.
Section 10.0 – Registers 10-1 and 10-2 (Note 1), Table
10-2 (Note 2), Section 10.2.5, Section 10.3,
Table 10-3, Table 10-4, Table 10-5, Section 10.4,
Section 10.5, Section 10.6.1, Section 10.9, 10.9.1,
10.9.2, Section 10.11.
Section 13.0 – 13.1 DC Characteristics, 13.2 DC
Characteristics, Table 13-1, Table 13-3, Table 13-4.
Revision C (03/2007)
Revised Table 3-2 GP3 and Legend; Revised Table 3-
3 RB3 and Legend; Updated Registers to new format;
Revised Section 9.1; Revised Table 9-2; Revised 13.1
DC Characteristics D025; Revised Table 13-2 and
Table 13-3 and Notes; Replaced Package Drawings
(Rev. AN); Added DFN package; Replaced Develop-
ment Support Section; Revised Product ID System.
Revision D (11/2007)
Revised Table 1-1; Table 4-1, Table 4-2; Figure 4-5;
Register 7-1 (Note 1); Register 8-1; Figure 13-4; 13.1 -
13.3; Table 13-1, Table 13-3, Table 13-6, Table 13-7,
Table 13-9; Figure 14-4, Figure 14-14; Section 14.0;
Packaging; Product ID System.
© 2007 Microchip Technology Inc.
DS41268D-page 115