MT18HTF6472DY-40EB2 Micron Technology Inc, MT18HTF6472DY-40EB2 Datasheet - Page 7

• Manufacturer Part Number: MT18HTF6472DY-40EB2
• Description: MODULE SDRAM DDR2 512MB 240DIMM
• Manufacturer: Micron Technology Inc

Specifications of MT18HTF6472DY-40EB2

• Memory Type: DDR2 SDRAM
• Memory Size: 512MB
• Speed: 400MT/s
• Package / Case: 240-DIMM
• Main Category: DRAM Module
• Sub-category: DDR2 SDRAM
• Module Type: 240RDIMM
• Device Core Size: 72b
• Organization: 64Mx72
• Total Density: 512MByte
• Chip Density: 256Mb
• Access Time (max): 60ps
• Maximum Clock Rate: 400MHz
• Operating Supply Voltage (typ): 1.8V
• Operating Current: 1.17A
• Number Of Elements: 18
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 240
• Mounting: Socket
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Electrical Specifications
Table 8:
Input Capacitance
Component AC Timing and Operating Conditions
Table 9:
PDF: 09005aef80e935cd/Source: 09005aef80e934a6
HTF18C64_128_256x72D.fm - Rev. E 2/07 EN
V
V
Symbol
DD
IN
I
VREF
, V
T
I
/V
T
OZ
I
C
I
A
1
DD
OUT
Q
Absolute Maximum Ratings
Module and Component Speed Grade
Parameter
V
Voltage on any pin relative to V
Input leakage current; Any input 0V ≤ V
input 0V ≤ V
0V)
Output leakage current; 0V ≤ V
ODT are disabled
V
Module ambient operating temperature
DDR2 SDRAM component case operating
temperature
REF
DD
Module Speed Grade
Notes:
supply voltage relative to V
leakage current; V
IN
2
Stresses greater than those listed in Table 8 may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions above those indicated in each device’s data sheet is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
1. The refresh rate is required to double when 85°C < T
2. For further information, refer to technical note
Micron encourages designers to simulate the performance of the module to achieve
optimum values. Simulations are significantly more accurate and realistic than a gross
estimation of module capacitance when inductance and delay parameters associated
with trace lengths are used in simulations. JEDEC modules are currently designed using
simulations to close timing budgets.
Recommended AC operating conditions are given in the DDR2 component data sheets.
Component specifications are available on Micron’s Web site. Module speed grades
correlate with component speed grades, as shown in Table 9.
-80E
-800
-667
-53E
-40E
≤ 0.95V; (All other pins not under test =
on Micron’s Web site.
512MB, 1GB, 2GB (x72, ECC, DR) 240-Pin DDR2 SDRAM RDIMM
REF
= valid V
OUT
SS
SS
≤ V
REF
DD
level
IN
Q; DQs and
≤ V
DD
7
; V
REF
Command/address
RAS#, CAS#, WE#, S#,
CKE, ODT, BA
CK, CK#
DM
DQ, DQS, DQS#
Commercial
Industrial
Commercial
Industrial
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Component Speed Grade
TN-00-08: “Thermal
C
≤ 95°C.
Electrical Specifications
-25E
-37E
-25
-5E
-3
©2003 Micron Technology, Inc. All rights reserved.
–250
Min
–0.5
–0.5
–10
–10
–36
–40
–40
–5
0
0
Applications,” available
Max
+250
+2.3
+2.3
+10
+10
+36
+70
+85
+85
+95
+5
Units
µA
µA
µA
°C
°C
V
V