MT16VDDF12864HG-40BF2 Micron Technology Inc, MT16VDDF12864HG-40BF2 Datasheet - Page 10

• Manufacturer Part Number: MT16VDDF12864HG-40BF2
• Description: MODULE DDR SDRAM 1GB 200-SODIMM
• Manufacturer: Micron Technology Inc

Specifications of MT16VDDF12864HG-40BF2

• Memory Type: DDR SDRAM
• Memory Size: 1GB
• Speed: 400MT/s
• Package / Case: 200-SODIMM
• Main Category: DRAM Module
• Sub-category: DDR SDRAM
• Module Type: 200SODIMM
• Device Core Size: 64b
• Organization: 128Mx64
• Total Density: 1GByte
• Chip Density: 512Mb
• Maximum Clock Rate: 400MHz
• Operating Supply Voltage (typ): 2.6V
• Operating Current: 1.6A
• Number Of Elements: 16
• Operating Supply Voltage (max): 2.7V
• Operating Supply Voltage (min): 2.5V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Pin Count: 200
• Mounting: Socket
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table 6:
NOTE:
Table 7:
pdf: 09005aef80b57837, source: 09005aef80b577fa
DDAF16C64_128x64HG.fm - Rev. D 9/04 EN
1. For a burst length of two, A1-Ai select the two-data-ele-
2. For a burst length of four, A2-Ai select the four-data-
3. For a burst length of eight, A3-Ai select the eight-data-
4. Whenever a boundary of the block is reached within a
5. i = 9 (512MB);
LENGTH
BURST
ment block; A0 selects the first access within the block.
element block; A0-A1 select the first access within the
block.
element block; A0-A2 select the first access within the
block.
given sequence above, the following access wraps
within the block.
i = 9, 11 (1GB)
SPEED
2
4
8
-40B
A2 A1 A0
0
0
0
0
1
1
1
1
STARTING
ADDRESS
COLUMN
Burst Definition Table
CAS Latency (CL) Table
75
A1 A0
0
0
1
1
0
0
1
1
0
0
1
1
CL = 2
f
A0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
CLOCK FREQUENCY (MHZ)
ALLOWABLE OPERATING
133
ORDER OF ACCESSES WITHIN
0-1-2-3-4-5-6-7
1-2-3-4-5-6-7-0
2-3-4-5-6-7-0-1
3-4-5-6-7-0-1-2
4-5-6-7-0-1-2-3
5-6-7-0-1-2-3-4
6-7-0-1-2-3-4-5
7-0-1-2-3-4-5-6
SEQUENTIAL
TYPE =
0-1-2-3
1-2-3-0
2-3-0-1
3-0-1-2
75
CL = 2.5
0-1
1-0
f
A BURST
167
INTERLEAVED
0-1-2-3-4-5-6-7
1-0-3-2-5-4-7-6
2-3-0-1-6-7-4-5
3-2-1-0-7-6-5-4
4-5-6-7-0-1-2-3
5-4-7-6-1-0-3-2
6-7-4-5-2-3-0-1
7-6-5-4-3-2-1-0
133
TYPE =
0-1-2-3
1-0-3-2
2-3-0-1
3-2-1-0
CL = 3
0-1
1-0
f
200
10
Operating Mode
MODE REGISTER SET command with bits A7–A12
each set to zero, and bits A0–A6 set to the desired val-
ues. A DLL reset is initiated by issuing a MODE REGIS-
TER SET command with bits A7 and A9–A12 each set
to zero, bit A8 set to one, and bits A0–A6 set to the
desired values. Although not required by the Micron
device, JEDEC specifications recommend when a
LOAD MODE REGISTER command is issued to reset
the DLL, it should always be followed by a LOAD
MODE REGISTER command to select normal operat-
ing mode.
reserved for future use and/or test modes. Test modes
and reserved states should not be used because
unknown operation or incompatibility with future ver-
sions may result.
COMMAND
COMMAND
COMMAND
The normal operating mode is selected by issuing a
All other combinations of values for A7–A12 are
DQS
512MB, 1GB (x64, DR) PC3200
DQS
DQS
CK#
CK#
CK#
DQ
DQ
DQ
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Figure 6: CAS Latency Diagram
CK
CK
CK
READ
READ
READ
Burst Length = 4 in the cases shown
Shown with nominal t AC, t DQSCK, and t DQSQ
T0
T0
T0
200-PIN DDR SODIMM
CL = 2
TRANSITIONING DATA
CL = 2.5
NOP
NOP
NOP
T1
T1
T1
CL = 3
T2
NOP
NOP
NOP
T2
T2
©2004 Micron Technology, Inc.
T2n
T2n
T2n
DON’T CARE
T3
NOP
NOP
NOP
T3
T3
T3n
T3n
T3n