C8051F530-IMR Silicon Labs, C8051F530-IMR Datasheet - Page 39

• Manufacturer Part Number: C8051F530-IMR
• Description: 8-bit Microcontrollers - MCU 8KB 12ADC 125C
• Manufacturer: Silicon Labs

Specifications of C8051F530-IMR

• Product Category: 8-bit Microcontrollers - MCU
• Rohs: yes
• Core: 8051
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 25 MHz
• Program Memory Size: 8 KB
• Data Ram Size: 256 B
• On-chip Adc: Yes
• Package / Case: QFN EP
• Mounting Style: SMD/SMT
• A/d Bit Size: 12 bit
• A/d Channels Available: 16
• Interface Type: SPI, UART
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• On-chip Dac: No
• Processor Series: C8051
• Program Memory Type: Flash
• Factory Pack Quantity: 1500
• Supply Voltage - Max: 2.7 V, 5.25 V
• Supply Voltage - Min: 2 V, 2.7 V

Table 3.3. DFN-10 Landing Diagram Dimensions
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter
7. A 4x1 array of 1.60 x 0.45 mm openings on 0.65 mm pitch should be used for
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
between the solder mask and the metal pad is to be 60 µm minimum, all the
way around the pad.
should be used to assure good solder paste release.
pads.
the center ground pad.
specification for Small Body Components.
Dimension
C1
X1
X2
Y1
Y2
E
Figure 3.3. DFN-10 Landing Diagram
Rev. 1.4
2.90
0.20
1.70
0.70
2.45
Min
0.50 BSC.
C8051F52x/F53x
Max
3.00
0.30
1.80
0.80
2.55
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