CP2400 SILABS [Silicon Laboratories], CP2400 Datasheet - Page 31

• Manufacturer Part Number: CP2400
• Description: 128/64 SEGMENT LCD DRIVER
• Manufacturer: SILABS [Silicon Laboratories]

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
4. A 3 x 3 array of 1.0 mm square openings on 1.25 mm pitch should be used for the
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
be used to assure good solder paste release.
center ground pad.
for Small Body Components.
Dimension
C1
C2
X1
X2
Y1
Y2
E
Table 4.5. PCB Land Pattern
Rev. 1.0
4.80
4.80
0.20
3.20
0.75
3.20
MIN
0.50 BSC
MAX
4.90
4.90
0.30
3.40
0.85
3.40
CP2400/1/2/3
31