s71gs256nc0bawak0 Meet Spansion Inc., s71gs256nc0bawak0 Datasheet - Page 15

• Manufacturer Part Number: s71gs256nc0bawak0
• Description: Stacked Multi-chip Product Mcp 256/128 Megabit 16/8m X 16-bit Cmos 3.0 Volt Vcc And 1.8 V Vio Mirrorbit Tm Uniform Sector Page-mode Flash Memory With 64/32 Megabit 4/2m X 16-bit 1.8v Psram
• Manufacturer: Meet Spansion Inc.

Physical Dimensions
December 17, 2004 S71GS256/128N_00_A0
TLA084—84-ball Fine-Pitch Ball Grid Array (FBGA) 8.0 x 11.6 x1.2 mm MCP
Compatible Package
PACKAGE
SYMBOL
SD / SE
JEDEC
A
D x E
Ø b
MD
ME
A1
A2
D1
E1
eE
eD
A
D
E
n
CORNER
0.15
(2X)
PIN A1
A2
A1
H1,H10,J1,J10,K1,K10,L1,L10,
C
M2,M3,M4,M5,M6,M7,M8,M9
MIN
0.17
0.81
0.35
A2,A3,A4,A5,A6,A7,A8,A9
84X
---
B1,B10,C1,C10,D1,D10,
E1,E10,F1,F10,G1,G10,
11.60 mm x 8.00 mm
0.15
0.08
INDEX MARK
11.60 BSC.
PACKAGE
6
8.00 BSC.
8.80 BSC.
7.20 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
TLA 084
b
NOM
0.40
M
M
N/A
10
---
---
---
12
10
84
A d v a n c e
C A B
C
SIDE VIEW
TOP VIEW
MAX
1.20
0.97
0.45
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
I n f o r m a t i o n
C
0.15
A
(2X)
E
B
C
0.20 C
0.08
eE
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
10
eD
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
M L
K
SD
BOTTOM VIEW
7
J
H
G
D1
F
E
D C
B
A
SE
CORNER
PIN A1
3372-2 \ 16-038.22a
7
E1
15